公开(公告)号：US20150035184A1

公开(公告)日：2015-02-05

申请号：US14447590

申请日：2014-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwangsick KIM ,  JaeYong PARK

IPC: B29C33/10

CPC classification number: B29C33/10 ,  B29C43/18 ,  B29C2043/181

Abstract: A substrate manufacturing facility includes a lower molding plate and an upper molding plate. A resin supply tray provides resin powder to a top surface of the lower molding plate. The lower and upper molding plates may compress a substrate and the resin powder. The upper molding plate has multiple apertures. The apertures are densely formed on a front side of the upper molding plate. The front side of the upper molding plate contacts the substrate. The apertures have diameters smaller than diameters of the resin powder. The substrate manufacturing facility includes a vacuum pump, a ventilator, a conduit, a controller, and valves. The substrate manufacturing facility can adsorb a circuit board using adsorption pressure from the vacuum pump and clean residue from the upper molding using exhaustion pressure from the ventilator.

Abstract translation: 基板制造设备包括下成型板和上成型板。 树脂供给托盘将树脂粉末提供到下模板的顶表面。 下模板和上模板可压缩基材和树脂粉末。 上模板具有多个孔。 这些孔密集地形成在上模板的正面上。 上模板的前侧接触基板。 孔的直径小于树脂粉末的直径。 基板制造设备包括真空泵，通风机，导管，控制器和阀。 基板制造设备可以使用来自真空泵的吸附压力吸附电路板，并且使用来自呼吸机的排气压力从上模具中清洁残留物。