公开(公告)号：US20150035184A1

公开(公告)日：2015-02-05

申请号：US14447590

申请日：2014-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwangsick KIM ,  JaeYong PARK

IPC: B29C33/10

CPC classification number: B29C33/10 ,  B29C43/18 ,  B29C2043/181

Abstract: A substrate manufacturing facility includes a lower molding plate and an upper molding plate. A resin supply tray provides resin powder to a top surface of the lower molding plate. The lower and upper molding plates may compress a substrate and the resin powder. The upper molding plate has multiple apertures. The apertures are densely formed on a front side of the upper molding plate. The front side of the upper molding plate contacts the substrate. The apertures have diameters smaller than diameters of the resin powder. The substrate manufacturing facility includes a vacuum pump, a ventilator, a conduit, a controller, and valves. The substrate manufacturing facility can adsorb a circuit board using adsorption pressure from the vacuum pump and clean residue from the upper molding using exhaustion pressure from the ventilator.

Abstract translation: 基板制造设备包括下成型板和上成型板。 树脂供给托盘将树脂粉末提供到下模板的顶表面。 下模板和上模板可压缩基材和树脂粉末。 上模板具有多个孔。 这些孔密集地形成在上模板的正面上。 上模板的前侧接触基板。 孔的直径小于树脂粉末的直径。 基板制造设备包括真空泵，通风机，导管，控制器和阀。 基板制造设备可以使用来自真空泵的吸附压力吸附电路板，并且使用来自呼吸机的排气压力从上模具中清洁残留物。

公开(公告)号：US20170133249A1

公开(公告)日：2017-05-11

申请号：US15335988

申请日：2016-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： YOUNGMIN KIM ,  JaeYong PARK ,  KUNHO SONG ,  Byung-Joo JO

IPC: H01L21/67 ,  B32B38/00 ,  B28D5/02 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  B32B37/12 ,  H01L21/687

CPC classification number: H01L21/67132 ,  B28D5/0082 ,  B28D5/022 ,  B32B37/1009 ,  B32B38/0004 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/742 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T156/1062 ,  Y10T156/1322

Abstract: A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.

公开(公告)号：US20170352640A1

公开(公告)日：2017-12-07

申请号：US15684425

申请日：2017-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： JaeYong PARK ,  Junyoung KO ,  Whasu SIN ,  Kyhyun JUNG

IPC: H01L23/00 ,  B23K1/005 ,  B23K26/38 ,  H05K13/04 ,  B23K1/00 ,  B23K1/018 ,  B23K101/42

CPC classification number: H01L24/799 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/018 ,  B23K26/38 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K13/0486 ,  Y10T29/49821 ,  Y10T29/53274

Abstract: A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

公开(公告)号：US20150179601A1

公开(公告)日：2015-06-25

申请号：US14632657

申请日：2015-02-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： JaeYong PARK ,  Junyoung KO ,  Whasu SIN ,  Kyhyun JUNG

IPC: H01L23/00 ,  B23K1/018 ,  B23K26/38

CPC classification number: H01L24/799 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/018 ,  B23K26/38 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K13/0486 ,  Y10T29/49821 ,  Y10T29/53274

Abstract: An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.

Abstract translation: 一种用于从板上去除半导体芯片的装置可以包括：激光器，被配置成用激光束照射板，以加热将半导体芯片安装在板上的凸块; 拾取器，被配置为将半导体芯片与板分离; 真空部分，被配置为向拾取器提供真空; 和摄入。 如果作为凸块的残留物的焊料柱被激光束熔化，则吸入件使用从真空部分提供的真空去除焊料柱。 用于从板上去除半导体芯片的装置可以包括：被配置为通过凸块来支撑半导体芯片安装在其上的板的台; 激光器，被配置为用激光束照射所述板，以加热将所述半导体芯片安装在所述板上的所述凸块; 以及构造成将半导体芯片与板分离的拾取器。

公开(公告)号：US20130292833A1

公开(公告)日：2013-11-07

申请号：US13837279

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae In WON ,  KYHYUN JUNG ,  JaeYong PARK

IPC: H01L23/498

CPC classification number: H01L23/49816 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device may include a lower semiconductor package including at least one lower semiconductor chip, at least one upper semiconductor package mounted on the lower semiconductor package to include at least one upper semiconductor chip, a molding layer provided between the lower and upper semiconductor packages, and connection solder balls provided in the molding layer to electrically connect the lower and upper semiconductor packages to each other. Each of the connection solder balls may include a portion protruding upward from the molding layer, and there may be no gap between the connection solder balls and the molding layer.

Abstract translation: 半导体器件可以包括下半导体封装，其包括至少一个下半导体芯片，安装在下半导体封装上的至少一个上半导体封装以包括至少一个上半导体芯片，设置在下半导体封装和上半导体封装之间的模制层， 以及设置在模制层中的连接焊球，以将下半导体封装和上半导体封装彼此电连接。 每个连接焊球可以包括从成型层向上突出的部分，并且连接焊球和成型层之间可以没有间隙。