METHOD AND ELECTRONIC DEVICE FOR REGULATING RADIATED POWER

    公开(公告)号:US20230396343A1

    公开(公告)日:2023-12-07

    申请号:US18451017

    申请日:2023-08-16

    CPC classification number: H04B17/102 H04B1/3838

    Abstract: An electronic device may include: a communication module that identifies an environment for communication with an external electronic device, and radiates a signal via an antenna; a grip sensor; a memory; and a processor operatively connected to the communication module, the grip sensor, and the memory. The processor may: identify the environment for communication with the external electronic device, or an intensity of radiated power via the antenna; compare the identified intensity of radiated power and a configured threshold value; and, according to the result of the comparison, regulate power supplied to the grip sensor. Other various embodiments may be possible.

    ELECTRONIC DEVICE AND METHOD FOR CONTROLLING OPERATION OF ELECTRONIC DEVICE

    公开(公告)号:US20200012271A1

    公开(公告)日:2020-01-09

    申请号:US16495526

    申请日:2018-03-28

    Abstract: Provided in various embodiments are an electronic device and a method for controlling the operation of the electronic device, the electronic device comprising: a housing; a conductive element positioned at a part of the housing or inside the housing; a sensing circuit electrically connected to the conductive element and sensing that an external object comes in contact therewith or is close thereto; and a processor, wherein the processor detects the generation of an interrupt, confirms whether the generated interrupt is a predetermined interrupt, and can reset the sensing circuit on the basis of the result produced by confirming whether the generated interrupt is a predetermined interrupt, and/or an output value of the sensing circuit. In addition, various embodiments are possible.

    ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD ASSEMBLY

    公开(公告)号:US20230254393A1

    公开(公告)日:2023-08-10

    申请号:US18113257

    申请日:2023-02-23

    CPC classification number: H04M1/0277 H05K9/0081

    Abstract: According to an example embodiment of the disclosure, an electronic device may include a first printed circuit board, a second printed circuit board, multiple first conductive portions, multiple second conductive portions, and multiple third conductive portions. The second printed circuit board may be disposed to at least partially overlap the first printed circuit board. The multiple first conductive portions may be arranged in a first area between the first printed circuit board and the second printed circuit board. The multiple first conductive portions may electrically and mechanically connect the first printed circuit board and the second printed circuit board. The multiple second conductive portions may be arranged in a second area, surrounding at least a part of the first area, between the first printed circuit board and the second printed circuit board. The multiple second conductive portions may electrically and mechanically connect the first printed circuit board and the second printed circuit board. The multiple third conductive portions may be arranged in the second area. The multiple third conductive portions may electrically connect at least two of the multiple second conductive portions. The multiple second conductive portions may electrically connect a first ground area included in the first printed circuit board and a second ground area included in the second printed circuit board.

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