公开(公告)号：US20230384836A1

公开(公告)日：2023-11-30

申请号：US18448469

申请日：2023-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong YOON ,  Wansang RYU

IPC: G06F1/16 ,  H05K5/03 ,  H04R1/02

CPC classification number: G06F1/1656 ,  H05K5/03 ,  H04R1/02 ,  G06F1/1607

Abstract: According to an embodiment of the present disclosure, an electronic device comprises: a microphone module including a microphone; a housing accommodating the microphone module and having at least one part surrounded by a protective cover configured to accommodate a digital pen, the housing comprising a microphone hole facing the protective cover; and a processor disposed inside the housing, wherein the processor may be configured to: determine a state of the digital pen mounted on the protective cover based on a sound generated by a protrusion of the protective cover contacting a groove of the digital pen, by the microphone module.

公开(公告)号：US20230396343A1

公开(公告)日：2023-12-07

申请号：US18451017

申请日：2023-08-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyuyeon JEON ,  Yongsang YUN ,  Hyunjoong YOON

IPC: H04B17/10 ,  H04B1/3827

CPC classification number: H04B17/102 ,  H04B1/3838

Abstract: An electronic device may include: a communication module that identifies an environment for communication with an external electronic device, and radiates a signal via an antenna; a grip sensor; a memory; and a processor operatively connected to the communication module, the grip sensor, and the memory. The processor may: identify the environment for communication with the external electronic device, or an intensity of radiated power via the antenna; compare the identified intensity of radiated power and a configured threshold value; and, according to the result of the comparison, regulate power supplied to the grip sensor. Other various embodiments may be possible.

公开(公告)号：US20210029855A1

公开(公告)日：2021-01-28

申请号：US16899118

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong YOON ,  Myunghoon KWAK ,  Minki PARK ,  Youngjae YOU ,  Yongsang YUN

IPC: H05K9/00 ,  H05K7/20 ,  H01L23/40 ,  H01L23/552

Abstract: An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.

公开(公告)号：US20230188633A1

公开(公告)日：2023-06-15

申请号：US18163283

申请日：2023-02-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoong YOON ,  Myungsuk KIM

IPC: H04M1/02

CPC classification number: H04M1/0277

Abstract: An electronic apparatus includes a housing, a display module disposed inside the housing and forming a portion of the surface of the electronic apparatus, a first substrate which is disposed inside the housing, and includes a first surface facing the display module and a second surface opposite to the first surface, and a fixing structure for fixing the first substrate to the housing. The fixing structure includes a first boss protruding from the inner surface of the housing toward the first substrate and defining a first screw hole, a reinforcing member disposed on the first substrate, and a screw passing through the first boss and the reinforcing member. The first boss includes a support portion, which supports a second surface of the first substrate, and an extension portion, at least a portion of which extends from the support portion and protrudes to a first surface of the first substrate.

公开(公告)号：US20230171932A1

公开(公告)日：2023-06-01

申请号：US18160475

申请日：2023-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong YOON ,  Heesoon PARK

IPC: H05K9/00 ,  H01Q1/24 ,  H04M1/02 ,  H05K7/20

CPC classification number: H05K9/0081 ,  H01Q1/243 ,  H04M1/0277 ,  H05K7/20963

Abstract: An electronic device includes an electronic component on ae printed circuit board, an electrical shield extended around the electronic component and defining an opening corresponding to the electronic component, a heat diffusion pattern on the electronic component, and a shielding sheet which extends across the opening of the electrical shield and commonly overlaps the electronic component, the electrical shield and the heat diffusion pattern. The shielding sheet includes a first heat diffusion member which is inside the opening of the electrical shield and contacts the heat diffusion pattern, and a second heat diffusion member which is attached to the first heat diffusion member, extends across the opening of the electrical shield and contacts both an upper portion of the electrical shield and the first heat diffusion member.

公开(公告)号：US20230126247A1

公开(公告)日：2023-04-27

申请号：US17974044

申请日：2022-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoong YOON ,  Gyunghoon LEE ,  Yongwon CHO

IPC: G06F1/16 ,  H01Q1/22

Abstract: An electronic device includes a first housing, a second housing, a hinge device that foldably couples the first housing and the second housing to each other, and at least one electrical connection member that connects a component included in the first housing and a component included in the second housing, to each other. The hinge device may include at least one hinge, at least one first hinge bracket that connects the hinge and the first housing to each other, at least one second hinge bracket that connects the hinge and the second housing to each other, and a support that supports the at least one electrical connection member, where the support may be fixed via the same fastening structure as the first hinge bracket.

公开(公告)号：US20230082434A1

公开(公告)日：2023-03-16

申请号：US17835111

申请日：2022-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong YOON ,  Yongwon CHO

IPC: H05K7/20 ,  H05K1/02

Abstract: An electronic device and a support plate are disclosed. The electronic device includes a first housing, a display disposed within the first housing, a printed circuit board disposed within the first housing, a heat dissipation plate disposed to face the printed circuit board, at least one heat pipe disposed between the heat dissipation plate and the printed circuit board, the support plate disposed between the printed circuit board and the heat dissipation plate. The support plate includes a first portion disposed so as to contact with at least a part of the at least one heat pipe, and a second portion extending from the first portion in a second direction perpendicular to a first direction in which the at least one heat pipe is disposed, the second portion coupled to at least a part of the heat dissipation plate.

公开(公告)号：US20210392787A1

公开(公告)日：2021-12-16

申请号：US17289285

申请日：2019-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haein CHUNG ,  Kyungha KOO ,  Seungjae BAE ,  Hyunjoong YOON ,  Jaeho CHUNG ,  Yongwon CHO

IPC: H05K7/20 ,  G06F1/20 ,  H05K9/00

Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.