公开(公告)号：US20200061946A1

公开(公告)日：2020-02-27

申请号：US16433600

申请日：2019-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se-Gon ROH ,  Changhyun ROH ,  Youngbo SHIM ,  Byung-Kwon CHOI ,  Haewook AHN ,  Mikyung PARK ,  Yeiji BAE ,  Minho CHOI

IPC: B29D35/00 ,  B29D35/12

Abstract: A method of manufacturing an insole may include providing an electronic element on a support layer; connecting a connector to the support layer; providing the support layer to a lower mold frame; covering the lower mold frame with an upper mold frame; and applying a foam material between the lower mold frame and the upper mold frame.

公开(公告)号：US20200060379A1

公开(公告)日：2020-02-27

申请号：US16433435

申请日：2019-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se-Gon ROH ,  Changhyun ROH ,  Youngbo SHIM ,  Byung-Kwon CHOI ,  Haewook AHN ,  Mikyung PARK ,  Yeiji BAE ,  Minho CHOI

IPC: A43B3/00 ,  A61B5/103 ,  A61B5/11 ,  A43B17/18

Abstract: An insole may include an insole body in a shape receivable in a shoe; an electronic element provided in the insole body; a connection line configured to electrically connect to the electronic element and including a contact terminal exposed to the outside of the insole body; and a connector including a detachable member configured to at least partially protrude outward from the insole body and configured to support the contact terminal.