公开(公告)号：US11622184B2

公开(公告)日：2023-04-04

申请号：US17250590

申请日：2019-08-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinwoo Kim ,  Sujin Jung ,  Hakrae Kang ,  Heejun Park ,  Minseok Shin ,  Changhwan Lee

IPC: H04R1/04 ,  H05K5/00

Abstract: According to an embodiment of the present invention, an electronic device may comprise: a housing; a printed circuit board disposed inside the housing, the printed circuit board comprising a first surface, a second surface facing away from the first surface, and a first through-hole and a second through-hole penetrating the first surface and the second surface; a first microphone disposed on the second surface so as to at least partially overlap the first through-hole when seen from above the first surface; a second microphone disposed on the second surface so as to at least partially overlap the second through-hole when seen from above the first surface; a support member disposed on the first surface, the support member comprising a third surface facing the first surface, a fourth surface facing away from the third surface, a third through-hole at least partially overlapping the first through-hole when seen from above the first surface, and a fourth through-hole at least partially overlapping the second through-hole when seen from above the first surface; a first sound-transmitting member disposed on the fourth surface so as to at least partially overlap the third through-hole; and a second sound-transmitting member disposed on the fourth surface so as to at least partially overlap the fourth through-hole. Various other embodiments may be included.