公开(公告)号：US20170176508A1

公开(公告)日：2017-06-22

申请号：US15379951

申请日：2016-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Jun SONG ,  Young Min KIM ,  Chang Su KIM ,  Han Gu KIM

IPC: G01R31/00 ,  G01R1/04

CPC classification number: G01R31/002 ,  G01R1/0416

Abstract: A test board for a semiconductor device and a test board including the same are provided. A test board includes a substrate, a mounting pad which is formed on the substrate and on which a semiconductor chip is mounted and a test terminal group arranged on the substrate to be spaced apart from the mounting pad and electrically connected to the semiconductor chip by a pattern arranged on the substrate, wherein the semiconductor chip includes a first terminal and a second terminal for inputting/outputting signals, the test terminal group includes a first test terminal electrically connected to the first terminal and a second test terminal electrically connected to the second terminal, a first voltage is applied to the first terminal and the second terminal, and a stress signal that is caused by a second voltage is applied to the first test terminal.