公开(公告)号：US20170176508A1

公开(公告)日：2017-06-22

申请号：US15379951

申请日：2016-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Jun SONG ,  Young Min KIM ,  Chang Su KIM ,  Han Gu KIM

IPC: G01R31/00 ,  G01R1/04

CPC classification number: G01R31/002 ,  G01R1/0416

Abstract: A test board for a semiconductor device and a test board including the same are provided. A test board includes a substrate, a mounting pad which is formed on the substrate and on which a semiconductor chip is mounted and a test terminal group arranged on the substrate to be spaced apart from the mounting pad and electrically connected to the semiconductor chip by a pattern arranged on the substrate, wherein the semiconductor chip includes a first terminal and a second terminal for inputting/outputting signals, the test terminal group includes a first test terminal electrically connected to the first terminal and a second test terminal electrically connected to the second terminal, a first voltage is applied to the first terminal and the second terminal, and a stress signal that is caused by a second voltage is applied to the first test terminal.

公开(公告)号：US20140300598A1

公开(公告)日：2014-10-09

申请号：US14310514

申请日：2014-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Korea University Industrial & Academic Collaberation Foundation

Inventor： Min Su AHN ,  Jeong Hwan AHN ,  Jae Kyun AHN ,  Dae Youn LEE ,  Chang Su KIM

IPC: G06T9/00

CPC classification number: G06T9/001 ,  G06T9/00 ,  G06T17/20 ,  G06T17/205

Abstract: Disclosed is a three-dimensional (3D) mesh compression apparatus and method. The 3D mesh compression apparatus may generate a base mesh through a mesh simplification, may separately compress the base mesh and vertices eliminated by the simplification, and may compress 3D mesh data based on the covariance matrix.

Abstract translation: 公开了三维（3D）网格压缩装置和方法。 3D网格压缩装置可以通过网格简化来生成基本网格，可以通过简化单独压缩基本网格和顶点，并且可以基于协方差矩阵来压缩3D网格数据。