公开(公告)号：US10923518B2

公开(公告)日：2021-02-16

申请号：US16014557

申请日：2018-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hong Ki Kim ,  Jung Chak Ahn ,  In Sung Joe

IPC: H01L27/146

Abstract: An image sensor and a method of fabricating the same are provided. The image sensor includes a substrate including photoelectric elements, a first color filter disposed on the substrate, a second color filter disposed on the substrate to be adjacent to the first color filter, a covering film disposed between sidewalls of the first and second color filters, and an air gap formed in the covering film.

公开(公告)号：US11205683B2

公开(公告)日：2021-12-21

申请号：US16787429

申请日：2020-02-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwan Sik Kim ,  Jin Hyung Kim ,  Chang Hwa Kim ,  Hong Ki Kim ,  Sang-Su Park ,  Beom Suk Lee ,  Jae Sung Hur

IPC: H01L33/00 ,  H01L21/00 ,  H01L27/30 ,  H01L51/44 ,  G02B1/18

Abstract: An image sensor includes a substrate having a photoelectric conversion element therein, a first insulating layer on the substrate, a contact penetrating through the first insulating layer, a color filter on at least one side of the contact, and a moisture absorption prevention layer in contact with a sidewall of the contact and extending on an upper surface of the color filter.