公开(公告)号：US20220201846A1

公开(公告)日：2022-06-23

申请号：US17559204

申请日：2021-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongkyu LEE ,  Hyoseok NA

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H04R19/04 ,  H04R3/00 ,  H04R1/04 ,  H04R1/08

Abstract: An electronic device is provided. The electronic device includes a printed circuit board (PCB) on which a plurality of PCBs is stacked and comprising a hole penetrating the plurality of PCBs, a microphone disposed on a first surface of the PCB and to which a sound is delivered through the hole, and an electrical conductive path formed in at least a part of or the entire hole. The electrical conductive path may be electrically connected to at least one of a ground of the PCB or a ground of the microphone.