公开(公告)号：US20020160583A1

公开(公告)日：2002-10-31

申请号：US10056009

申请日：2002-01-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoon Song

IPC: H01L021/30

CPC classification number: B81B7/007 ,  B81B2201/01 ,  H01H59/0009

Abstract: A MEMS relay is provided. The MEMS relay includes a first wafer, a second wafer, and a third wafer that are sequentially stacked. The first wafer includes driving electrodes positioned at the bottom surface of the first wafer, input signal electrodes and output signal electrodes formed adjacent to each other and corresponding to the driving electrodes, via holes formed through the first wafer on the driving electrodes, the input signal electrodes, and the output signal electrodes, and metal pads formed over the via holes. The second wafer includes a body including a sealing unit used to hermetically seal the first and third wafers with the second wafer interposed therebetween, a driving unit which is formed inside and isolated from the body, is an integrated body consisting of a silicon substrate, a passivation layer formed on the silicon substrate, and contact electrodes formed on the passivation layer, and is located lower than the top surface of the body by a predetermined distance, and a connection supporter which extends from two opposing sides of the driving unit to the inner surface of the body. The third wafer includes a hollow in which the driving unit can be rotated.

Abstract translation: 提供了MEMS继电器。 MEMS继电器包括依次层叠的第一晶片，第二晶片和第三晶片。 第一晶片包括位于第一晶片的底表面处的驱动电极，输入信号电极和彼此相邻形成并对应于驱动电极的输出信号电极，通过驱动电极上的第一晶片形成的通孔，输入信号 电极和输出信号电极以及形成在通孔上方的金属焊盘。 第二晶片包括主体，其包括用于密封第一晶片和第三晶片的密封单元，其间插入有第二晶片，形成在主体内部并与主体隔离的驱动单元是由硅基板， 形成在硅衬底上的钝化层和形成在钝化层上的接触电极，并且位于比主体的顶表面低一个预定距离处;以及连接支撑件，其从驱动单元的两个相对侧延伸到内部 身体表面。 第三晶片包括可驱动驱动单元旋转的中空部。