公开(公告)号：US20140372829A1

公开(公告)日：2014-12-18

申请号：US14269493

申请日：2014-05-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Jin PARK ,  Wonseok LEE ,  Hwajin JUNG

IPC: G06F11/10 ,  H03M13/11

CPC classification number: G06F11/1008

Abstract: A storage device in accordance with the inventive concepts includes at least one nonvolatile memory device and a memory controller controlling the nonvolatile memory device. The memory controller includes at least one processor configured to control an operation of the storage device, and configured to perform at least one of a trim operation according a trim command and a garbage collection operation and a risk protection controller configured to perform a risk protection operation that disables at least one of the garbage collection operation or the trim operation according to a risk protection signal internally generated or a risk protection command input from the external device.

Abstract translation: 根据本发明构思的存储设备包括至少一个非易失性存储器件和控制非易失性存储器件的存储器控​​制器。 所述存储器控制器包括至少一个处理器，其被配置为控制所述存储设备的操作，并且被配置为执行根据修剪命令和垃圾回收操作的修剪操作中的至少一个以及被配置为执行风险保护操作的风险保护控制器 根据内部产生的风险保护信号或从外部设备输入的风险保护命令，禁用垃圾收集操作或修剪操作中的至少一个。

公开(公告)号：US20210104292A1

公开(公告)日：2021-04-08

申请号：US16867631

申请日：2020-05-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byoungsul KIM ,  Hokyong LEE ,  Hwajin JUNG ,  Yongjoo CHOI

IPC: G11C29/44 ,  G11C29/34 ,  G11C29/14 ,  G11C7/10

Abstract: A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, tire package test, tire module test or the mounting test is failed.