公开(公告)号：US20220023963A1

公开(公告)日：2022-01-27

申请号：US17216922

申请日：2021-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangkeun AHN ,  Hyeji SHIN ,  Dongsoo LEE ,  Sangho JANG

IPC: B23K3/06 ,  B06B1/10

Abstract: Disclosed are ball jumping apparatuses and ball absorption methods using the same. The ball jumping apparatus comprises a fixing part, a moving part spaced apart from the fixing part, and a resilient member that connects the fixing part and the moving part to each other. The resilient member extends upwardly from the fixing part and has a connection with the moving part. The fixing part includes a fixing plate that spreads in a horizontal direction. The moving part includes an oscillating vessel that has a ball receiving space in which a ball is received, and an oscillator coupled to the oscillating vessel. A bottom surface of the oscillating vessel is upwardly spaced apart from a top surface of the fixing plate.