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公开(公告)号:US20220023963A1
公开(公告)日:2022-01-27
申请号:US17216922
申请日:2021-03-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangkeun AHN , Hyeji SHIN , Dongsoo LEE , Sangho JANG
Abstract: Disclosed are ball jumping apparatuses and ball absorption methods using the same. The ball jumping apparatus comprises a fixing part, a moving part spaced apart from the fixing part, and a resilient member that connects the fixing part and the moving part to each other. The resilient member extends upwardly from the fixing part and has a connection with the moving part. The fixing part includes a fixing plate that spreads in a horizontal direction. The moving part includes an oscillating vessel that has a ball receiving space in which a ball is received, and an oscillator coupled to the oscillating vessel. A bottom surface of the oscillating vessel is upwardly spaced apart from a top surface of the fixing plate.
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公开(公告)号:US20240321618A1
公开(公告)日:2024-09-26
申请号:US18610612
申请日:2024-03-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Suhwan SHIM , Sungchul KIM , Sangho JANG , Youngshin CHOI
IPC: H01L21/68 , H01L21/66 , H01L21/67 , H01L21/673 , H01L21/683
CPC classification number: H01L21/681 , H01L21/67259 , H01L21/67333 , H01L21/6838 , H01L22/20
Abstract: A semiconductor manufacturing apparatus includes a semiconductor package. A tray has the semiconductor package seated thereon. An inspector inspects an alignment state of the semiconductor package. A protrusion is on a top surface of the tray and extends in a Z direction that is a vertical direction. The protrusion surrounds a side surface of the semiconductor package when the semiconductor package is in an aligned state. The semiconductor package overlaps at least a portion of the protrusion in the Z direction when the semiconductor package is in a misaligned state. An under vision camera detects a rotation angle of the semiconductor package with respect to an X-Y plane defined in a first horizontal direction X and a second horizontal direction Y that cross the Z direction. A picker moves the semiconductor package between the tray and an area above the under vision camera.
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公开(公告)号:US20240047253A1
公开(公告)日:2024-02-08
申请号:US18177300
申请日:2023-03-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangho JANG , Dongsoo LEE , Kibeom KIL , Yeongseok KIM , Wooram OH , Youngshin CHOI
IPC: H01L21/677 , B65G47/90 , H01L21/67 , H05K13/00
CPC classification number: H01L21/6773 , H01L21/67736 , H01L21/67742 , B65G47/901 , H01L21/67757 , H01L21/67144 , H05K13/0061
Abstract: A substrate loading apparatus includes a pickup apparatus configured to move a magazine in a first direction, a second direction and a third direction, an elevator defining a plurality of waiting spaces, a stage configured to support the magazine, and an insert apparatus configured to transfer substrates in the magazine. At least one of the plurality of waiting spaces of the elevator is configured to selectively receive the magazine, and the pickup apparatus is spaced apart from the elevator and the stage in the third direction.
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公开(公告)号:US20220396380A1
公开(公告)日:2022-12-15
申请号:US17583653
申请日:2022-01-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kibeom KIL , Dongsoo LEE , Wooram OH , Sangho JANG
Abstract: A fluid supply apparatus includes a container supply holder configured to supply a container to a cap separator using a loading box, the container including a detachable nozzle cap, and configured to store a process fluid, a cap separator configured to receive the container from the loading box and separate the nozzle cap from a container body of the container using a cap clamper and a rotation actuator, the cap clamper configured to clamp and hold the nozzle cap, and the rotation actuator configured to rotate the container body, a fluid supplier configured to supply the process fluid contained in the container body through a fluid supply line, and a controller configured to control the container supply holder, the cap separator, and the fluid supplier.
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