-
公开(公告)号：US20250147665A1
公开(公告)日：2025-05-08
申请号：US18935341
申请日：2024-11-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Soon Ju KIM , Hyoun Kwon JEONG , Soogil JEONG
IPC: G06F3/06
Abstract: An apparatus may include a die including a memory interface, a die-to-die (D2D) circuit comprising a D2D interface, and an intermediate section connected between the memory interface and the D2D interface, wherein the intermediate section comprises a transaction converter. The intermediate section may be configured to transfer data through the D2D interface using a protocol. The D2D interface may be configured to transfer data using flow control. The D2D interface may be configured to transfer data using a raw format.
Search Results
1
records
(took 0.013 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
