公开(公告)号：US20250147665A1

公开(公告)日：2025-05-08

申请号：US18935341

申请日：2024-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soon Ju KIM ,  Hyoun Kwon JEONG ,  Soogil JEONG

IPC: G06F3/06

Abstract: An apparatus may include a die including a memory interface, a die-to-die (D2D) circuit comprising a D2D interface, and an intermediate section connected between the memory interface and the D2D interface, wherein the intermediate section comprises a transaction converter. The intermediate section may be configured to transfer data through the D2D interface using a protocol. The D2D interface may be configured to transfer data using flow control. The D2D interface may be configured to transfer data using a raw format.

公开(公告)号：US20250165415A1

公开(公告)日：2025-05-22

申请号：US18943849

申请日：2024-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soon Ju KIM ,  Kah Kawe CHANG

IPC: G06F13/20

Abstract: An apparatus may include a die including at least one circuit configured to receive, using a first channel of an on-die interface, first information, receive, using a second channel of the on-die interface, second information, generate one or more transaction units including the first information and the second information, and send, using at least one die-to-die system, the one or more transaction units. An apparatus may include a die including at least one circuit configured to receive, using at least one on-die interface, first information for a first transaction, receive, using the at least one on-die interface, second information for a second transaction, generate one or more transaction units including the first information and the second information, and send, using at least one die-to-die system, the one or more transaction units.