公开(公告)号：US11367714B2

公开(公告)日：2022-06-21

申请号：US16845567

申请日：2020-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jangwoo Lee ,  Jongbo Shim ,  Ji Hwang Kim ,  Yungcheol Kong ,  Youngbae Kim ,  Taehwan Kim ,  Hyunglak Ma

IPC: H01L25/10 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373

Abstract: A semiconductor package device may include a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. At least a portion of a top surface of the molding member may be spaced apart from a bottom surface of the second package substrate.