公开(公告)号：US11482554B2

公开(公告)日：2022-10-25

申请号：US16898610

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung Kang ,  Yungcheol Kong ,  Hyunsu Jun ,  Kyoungsei Choi

IPC: H01L27/146 ,  H01L31/0203 ,  H01L23/00 ,  H01L31/024

Abstract: A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.

公开(公告)号：US10262971B2

公开(公告)日：2019-04-16

申请号：US15469837

申请日：2017-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung Kang ,  Yungcheol Kong ,  Kyoungsei Choi

IPC: H01L25/04 ,  H01L23/49 ,  H01L23/528 ,  H01L27/146

Abstract: Provided are a stacked image sensor package and a packaging method thereof. A stacked image sensor package includes: a stacked image sensor in which a pixel array die and a logic die are stacked; a redistribution layer formed on one surface of the stacked image sensor, rerouting an input/output of the stacked image sensor, and including a first pad and a second pad; a memory die connected with the first pad of the redistribution layer and positioned on the stacked image sensor; and external connectors connected with the second pad, connecting the memory die and the stacked image sensor with an external device, and having the memory die positioned therebetween.

公开(公告)号：US11367714B2

公开(公告)日：2022-06-21

申请号：US16845567

申请日：2020-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jangwoo Lee ,  Jongbo Shim ,  Ji Hwang Kim ,  Yungcheol Kong ,  Youngbae Kim ,  Taehwan Kim ,  Hyunglak Ma

IPC: H01L25/10 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373

Abstract: A semiconductor package device may include a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. At least a portion of a top surface of the molding member may be spaced apart from a bottom surface of the second package substrate.

公开(公告)号：US20190074316A1

公开(公告)日：2019-03-07

申请号：US16177780

申请日：2018-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung KANG ,  Yungcheol Kong ,  Hyunsu Jun ,  Kyoungsei Choi

IPC: H01L27/146 ,  H01L31/024 ,  H01L31/0203 ,  H01L23/00

Abstract: A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.

公开(公告)号：US10756055B2

公开(公告)日：2020-08-25

申请号：US16295276

申请日：2019-03-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung Kang ,  Yungcheol Kong ,  Kyoungsei Choi

IPC: H01L25/04 ,  H01L27/146 ,  H01L23/00 ,  H01L23/49 ,  H01L23/528 ,  H01L23/48

Abstract: Provided are a stacked image sensor package and a packaging method thereof. A stacked image sensor package includes: a stacked image sensor in which a pixel array die and a logic die are stacked; a redistribution layer formed on one surface of the stacked image sensor, rerouting an input/output of the stacked image sensor, and including a first pad and a second pad; a memory die connected with the first pad of the redistribution layer and positioned on the stacked image sensor; and external connectors connected with the second pad, connecting the memory die and the stacked image sensor with an external device, and having the memory die positioned therebetween.

公开(公告)号：US10177188B2

公开(公告)日：2019-01-08

申请号：US15583224

申请日：2017-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung Kang ,  Yungcheol Kong ,  Hyunsu Jun ,  Kyoungsei Choi

IPC: H01L27/146 ,  H01L31/0203 ,  H01L23/00 ,  H01L31/024

Abstract: A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.