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公开(公告)号：US20240038603A1
公开(公告)日：2024-02-01
申请号：US18103747
申请日：2023-01-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunhaeng Heo , SUNGHOON KIM , JAEICK SON , SEUNGYEON KIM
Abstract: A semiconductor chip including a guard ring that surrounds edges of a semiconductor substrate, an internal circuit structure that is formed on the semiconductor substrate and that includes a memory cell array region and a peripheral circuit region, and a crack detection circuit that is located between the guard ring and the internal circuit structure and that detects whether a crack occurs. The semiconductor chip further includes first to fourth chamfer regions having different shapes and sizes depending on the position of a pad or the design arrangement of the internal circuit structure.
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