公开(公告)号：US20220208610A1

公开(公告)日：2022-06-30

申请号：US17699570

申请日：2022-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho YOON ,  Jungchul LEE ,  Byungmoon BAE ,  Junggeun SHIN ,  Hyunsu SIM

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683 ,  H01L21/304

Abstract: According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.

公开(公告)号：US20210159121A1

公开(公告)日：2021-05-27

申请号：US16909136

申请日：2020-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho YOON ,  Jungchul LEE ,  Byungmoon BAE ,  Junggeun SHIN ,  Hyunsu SIM

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/304 ,  H01L21/683

Abstract: According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.