公开(公告)号：US20170077041A1

公开(公告)日：2017-03-16

申请号：US15236868

申请日：2016-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： JinGyu KIM ,  Taehun KIM ,  JiSun HONG ,  Byungmoon BAE ,  Se-Ho YOU

IPC: H01L23/552 ,  H01L23/528 ,  H01L23/29 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/562 ,  H01L23/60 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16237 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: A package substrate includes a substrate including a circuit region, a dummy region surrounding the circuit region, and a lower circuit pattern at the dummy region, the circuit region including unit regions arranged in a matrix shape, and solders on the lower circuit pattern, at least one of the solders electrically connected to the lower circuit pattern.

Abstract translation: 封装基板包括：基板，其包括电路区域，围绕电路区域的虚设区域和虚设区域的下部电路图案，所述电路区域包括以矩阵形状排列的单位区域，以及位于下部电路图案上的焊料， 至少一个焊料电连接到较低电路图案。

公开(公告)号：US20220208610A1

公开(公告)日：2022-06-30

申请号：US17699570

申请日：2022-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho YOON ,  Jungchul LEE ,  Byungmoon BAE ,  Junggeun SHIN ,  Hyunsu SIM

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683 ,  H01L21/304

Abstract: According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.

公开(公告)号：US20210159121A1

公开(公告)日：2021-05-27

申请号：US16909136

申请日：2020-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho YOON ,  Jungchul LEE ,  Byungmoon BAE ,  Junggeun SHIN ,  Hyunsu SIM

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/304 ,  H01L21/683

Abstract: According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.