公开(公告)号：US20220293507A1

公开(公告)日：2022-09-15

申请号：US17514088

申请日：2021-10-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun LIM ,  Younghwan PARK ,  Kwangjin LEE ,  Dongha LEE ,  Hyuntaek CHOI

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  G06K9/00

Abstract: A fingerprint sensor package includes a first substrate including a core insulating layer; a first bonding pad on the core insulating layer; and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad, a second substrate on the core insulating layer, the second substrate including: a plurality of first sensing patterns spaced apart in a first direction and extending in a second direction intersecting with the first direction; a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; and a second bonding pad, a conductive wire connecting the first bonding pad to the second bonding pad; a controller chip on the second substrate; and a molding layer covering the second substrate and the first bonding pad and spaced apart from the external connection pad.

公开(公告)号：US20220129657A1

公开(公告)日：2022-04-28

申请号：US17500434

申请日：2021-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun LIM ,  Younghwan PARK ,  Kwangjin LEE ,  Inho CHOI ,  Hyuntaek CHOI

IPC: G06K9/00

Abstract: A fingerprint sensor package includes a package substrate including an upper surface in which a sensing region and a peripheral region surrounding the sensing region are defined, and a lower surface facing the upper surface; a plurality of first sensing patterns located are arranged in the sensing region, are apart from each other in a first direction, and extend in a second direction crossing the first direction; a plurality of second sensing patterns that are arranged in the sensing region, are apart from each other in the second direction, and extend in the first direction; a coating member covering the sensing region; an upper ground pattern in the peripheral region and apart from the coating member to surround the coating member in the first and second directions; and a controller chip on the lower surface of the package substrate; and a plurality of capacitors.