公开(公告)号：US20200006242A1

公开(公告)日：2020-01-02

申请号：US16201380

申请日：2018-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Kun JEE ,  II Hwan KIM ,  Un Byoung KANG

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

Abstract: A semiconductor package includes a silicon substrate including a cavity and a plurality of through holes spaced apart from the cavity, a first semiconductor chip in the cavity, a plurality of conductive vias in the plurality of through holes, a first redistribution layer on the silicon substrate and connected to the first semiconductor chip and the conductive vias, and a second redistribution layer below the silicon substrate and connected to the first semiconductor chip and the plurality of conductive vias.