公开(公告)号：US11310940B2

公开(公告)日：2022-04-19

申请号：US16766661

申请日：2018-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hong Ki Moon ,  Seung Hoon Kang ,  Yoon Sun Park ,  Kyung Ha Koo ,  In Kuk Yun ,  Se Young Jang ,  Hyo Seok Na

IPC: G06F1/20 ,  H04B1/036 ,  H05K7/20 ,  H01Q1/00 ,  H05K1/02

Abstract: An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member for encompassing a space between the first plate and the second plate; a circuit board arranged inside the housing and including at least one heating element; a first vapor chamber for receiving, through conduction, and dispersing, in at least a partial space between the first plate and the circuit board, heat released from the at least one heating element; a heat sink for receiving, through conduction, and absorbing, in at least a partial space between the circuit board and the second plate, heat released from the at least one heating element; and a fan for supplying air such that the heat absorbed by the heat sink is forcibly convected toward the outside of the electronic device. Additional various embodiments are possible.