公开(公告)号：US11464119B2

公开(公告)日：2022-10-04

申请号：US16766167

申请日：2019-08-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsu Kim ,  Hangyu Hwang ,  Sangsik Na ,  Jongbae Jeon ,  Pranveer Singh Rathore ,  Ingook Hong

IPC: H05K5/00 ,  B29C45/26 ,  H04B1/3827 ,  B29L31/34

Abstract: An electronic device according to various embodiments of the present disclosure includes a housing including a front plate facing a first direction, a rear plate facing a second direction that is opposite to the first direction, and side members for encompassing the inner space between the front plate and the rear plate; a display shown through at least a portion of the front plate; and a middle plate positioned between the front plate and the rear plate. The middle plate can include a first portion disposed between the front plate and the side members, when viewed from the outside of the housing. The first portion can include: a first surface supporting a portion of the front plate and facing the first direction; a second surface exposed to the outside of the housing; a third surface facing a third direction that is different from the first direction and the second direction, and facing the side surface of the front plate; and a protruding part protruding in the third direction on the third surface.

公开(公告)号：US11058015B2

公开(公告)日：2021-07-06

申请号：US16655938

申请日：2019-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hangyu Hwang ,  Changsu Kim ,  Dukjin Kim ,  Sooyoung Kim ,  Jongyoul Noh ,  Sangsik Na ,  Jongbae Jeon ,  Rathore Pranveer Singh ,  Ingook Hong

IPC: H05K5/00 ,  B29C45/27

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing in a direction opposite to that of the first plate, and a side member enclosing a space between the first plate and the second plate and formed with a method of solidifying a resin including a predetermined amount of rigidity reinforcing material injected into an injection mold and including a plurality of side surfaces, and a gate mark receiving portion formed in each of the plurality of side surfaces of the side member and configured to receive at least one gate mark according to separation of the injection mold. The gate mark receiving portion is formed by a processing portion disposed at a corresponding position inside a cavity of the injection mold.