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Patent Agency Ranking
公开(公告)号：US12287530B2
公开(公告)日：2025-04-29
申请号：US18615594
申请日：2024-03-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunjin Kang , Seunghak Lee , Insang Song
Abstract: Provided is a camera module including a housing having an opening, and a first lens assembly configured to move in the housing between a first position in which the first lens assembly is entirely provided in the housing, and a second position in which a portion of the first lens assembly protrudes external to the housing through the opening of the housing, a portion of the first lens assembly being attached to the housing by a magnetic force at the second position.
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公开(公告)号：US20240231041A1
公开(公告)日：2024-07-11
申请号：US18615594
申请日：2024-03-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunjin KANG , Seunghak Lee , Insang Song
CPC classification number: G02B7/102 , G02B13/009 , H04N23/55
Abstract: Provided is a camera module including a housing having an opening, and a first lens assembly configured to move in the housing between a first position in which the first lens assembly is entirely provided in the housing, and a second position in which a portion of the first lens assembly protrudes external to the housing through the opening of the housing, a portion of the first lens assembly being attached to the housing by a magnetic force at the second position.
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公开(公告)号：US11943523B2
公开(公告)日：2024-03-26
申请号：US17388594
申请日：2021-07-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Insang Song , Hyunjin Kang , Seunghak Lee
IPC: H04N23/55 , H01L27/146 , H04N23/54
CPC classification number: H04N23/55 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H04N23/54
Abstract: An image sensor device includes an image sensor, a substrate including first and second pads spaced apart from each other, a first support member on which an optical filter is mounted, a second support member further adjacent to an outer edge of the substrate than the first support member, and an optical device on the optical filter and the image sensor, wherein the image sensor is electrically connected to the first pad, and wherein at least one of the first or second support members is electrically connected to the second pad.
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公开(公告)号：US20220091363A1
公开(公告)日：2022-03-24
申请号：US17317464
申请日：2021-05-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunjin KANG , Seunghak Lee , Insang Song
Abstract: Provided is a camera module including a housing having an opening, and a first lens assembly configured to move in the housing between a first position in which the first lens assembly is entirely provided in the housing, and a second position in which a portion of the first lens assembly protrudes external to the housing through the opening of the housing, a portion of the first lens assembly being attached to the housing by a magnetic force at the second position.
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公开(公告)号：US11971604B2
公开(公告)日：2024-04-30
申请号：US17317464
申请日：2021-05-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunjin Kang , Seunghak Lee , Insang Song
CPC classification number: G02B7/102 , G02B13/009 , H04N23/55
Abstract: Provided is a camera module including a housing having an opening, and a first lens assembly configured to move in the housing between a first position in which the first lens assembly is entirely provided in the housing, and a second position in which a portion of the first lens assembly protrudes external to the housing through the opening of the housing, a portion of the first lens assembly being attached to the housing by a magnetic force at the second position.
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