公开(公告)号：US12287530B2

公开(公告)日：2025-04-29

申请号：US18615594

申请日：2024-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjin Kang ,  Seunghak Lee ,  Insang Song

IPC: G02B7/10 ,  G02B13/00 ,  H04N23/55

Abstract: Provided is a camera module including a housing having an opening, and a first lens assembly configured to move in the housing between a first position in which the first lens assembly is entirely provided in the housing, and a second position in which a portion of the first lens assembly protrudes external to the housing through the opening of the housing, a portion of the first lens assembly being attached to the housing by a magnetic force at the second position.

公开(公告)号：US11943523B2

公开(公告)日：2024-03-26

申请号：US17388594

申请日：2021-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Insang Song ,  Hyunjin Kang ,  Seunghak Lee

IPC: H04N23/55 ,  H01L27/146 ,  H04N23/54

CPC classification number: H04N23/55 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H04N23/54

Abstract: An image sensor device includes an image sensor, a substrate including first and second pads spaced apart from each other, a first support member on which an optical filter is mounted, a second support member further adjacent to an outer edge of the substrate than the first support member, and an optical device on the optical filter and the image sensor, wherein the image sensor is electrically connected to the first pad, and wherein at least one of the first or second support members is electrically connected to the second pad.

公开(公告)号：US11971604B2

公开(公告)日：2024-04-30

申请号：US17317464

申请日：2021-05-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjin Kang ,  Seunghak Lee ,  Insang Song

IPC: H04N23/55 ,  G02B7/10 ,  G02B13/00

CPC classification number: G02B7/102 ,  G02B13/009 ,  H04N23/55

Abstract: Provided is a camera module including a housing having an opening, and a first lens assembly configured to move in the housing between a first position in which the first lens assembly is entirely provided in the housing, and a second position in which a portion of the first lens assembly protrudes external to the housing through the opening of the housing, a portion of the first lens assembly being attached to the housing by a magnetic force at the second position.

公开(公告)号：US11914271B2

公开(公告)日：2024-02-27

申请号：US17845317

申请日：2022-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjin Kang ,  Hyunsu Jun ,  Younggyu Jung

IPC: G03B17/17 ,  G02B17/02 ,  H04M1/02 ,  G02B27/10

CPC classification number: G03B17/17 ,  G02B17/023 ,  G02B27/106 ,  H04M1/0264

Abstract: A multi-input folded camera includes a plurality of folding devices, a common lens array, and a sensor. The folding devices change paths lights that are incident to the folding devices and output a plurality of folded lights propagating along a plurality of paths. The common lens array combines the folded lights received through an input surface of the common lens array to output a combined light through an output surface of the common lens array. The sensor is at an optical axis of the common lens array to receive the combined light. Performance of a mobile device including the multi-input folded camera is enhanced by sufficient light amounts using the multiple folding devices and combining the lights through the multiple light paths. In implementing an under display camera (UDC), an entire-region display is supported without an aperture in a display panel.

公开(公告)号：US11706509B2

公开(公告)日：2023-07-18

申请号：US17699393

申请日：2022-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Hak Lee ,  Hyunjin Kang ,  In-Sang Song

IPC: H04N5/225 ,  H04N5/247 ,  H04N23/52 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H04N23/90

CPC classification number: H04N23/52 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H04N23/90

Abstract: An electronic system including a camera module comprises a camera module on a metal plate, a metal flange surrounding the camera module, a metal frame connected to the metal flange, and a first adhesion member between the metal flange and the metal plate. The camera module includes a substrate including a cavity, an image sensor in the cavity, and a lens assembly on the image sensor. An area of the metal plate is greater than that of the substrate, from a plan view. The metal plate includes a first part overlapping the substrate from the plan view, and a second part not overlapping the substrate from the plan view. The second part corresponds to an edge portion of the metal plate. The image sensor contacts the metal plate through an adhesive material. A lower portion of the metal flange and the second part of the metal plate contact the first adhesion member.