公开(公告)号：US10193549B2

公开(公告)日：2019-01-29

申请号：US14983405

申请日：2015-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nan-Wei Gong ,  Tobias Rick ,  Arun Rakesh Yoganandan ,  Henry Holtzman ,  Jae Woo Chung ,  Kumi Akiyoshi

IPC: G06F3/044 ,  H03K17/955 ,  G06F1/16 ,  G06F3/01 ,  G06F3/0346 ,  H05K1/18 ,  H05K1/02

Abstract: In one aspect, a modular sensing apparatus will be described. The modular sensing apparatus includes a flexible substrate and multiple sensors. The flexible substrate is reconfigurable into different shapes that conform to differently shaped structures. The multiple sensors are positioned on the substrate. Various embodiments relate to software, devices and/or systems that involve or communicate with the modular sensing apparatus.

公开(公告)号：US20170187377A1

公开(公告)日：2017-06-29

申请号：US14983405

申请日：2015-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nan-Wei Gong ,  Tobias Rick ,  Arun Rakesh Yoganandan ,  Henry Holtzman ,  Jae Woo Chung ,  Kumi Akiyoshi

IPC: H03K17/955 ,  G06F1/16 ,  H05K1/18 ,  G06F3/01 ,  G06F3/0346

CPC classification number: H03K17/955 ,  G06F1/1616 ,  G06F1/169 ,  G06F3/017 ,  G06F3/0346 ,  G06F3/044 ,  H03K2217/96015 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/10151

Abstract: In one aspect, a modular sensing apparatus will be described. The modular sensing apparatus includes a flexible substrate and multiple sensors. The flexible substrate is reconfigurable into different shapes that conform to differently shaped structures. The multiple sensors are positioned on the substrate. Various embodiments relate to software, devices and/or systems that involve or communicate with the modular sensing apparatus.