公开(公告)号：US09184065B2

公开(公告)日：2015-11-10

申请号：US14590383

申请日：2015-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

IPC: H01L21/00 ,  H01L21/52 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L21/565 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/06562

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract translation: 模制半导体封装的方法包括在设置在基板上的半导体芯片的顶表面上涂布液体模制树脂或将固体模塑树脂设置。 固体成型树脂可以包括粉末成型树脂或片状模塑树脂。 在半导体芯片的上表面上涂布有液态成型树脂的情况下，将基板安装在下模和上模之间，然后将熔融模制树脂填充在下模和上模之间的空间中。 在固体成形树脂设置在半导体芯片的顶面的情况下，将基板安装在下模上，然后将固体成型树脂加热熔融成具有流动性的液态成型树脂。 上模具安装在下模具上，熔融模塑树脂填充在下模和上模之间的空间中。

公开(公告)号：US20150118798A1

公开(公告)日：2015-04-30

申请号：US14590383

申请日：2015-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

IPC: H01L21/52 ,  H01L21/56

CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L21/565 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/06562

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract translation: 模制半导体封装的方法包括在设置在基板上的半导体芯片的顶表面上涂布液体模制树脂或将固体模塑树脂设置。 固体成型树脂可以包括粉末成型树脂或片状模塑树脂。 在半导体芯片的上表面上涂布有液态成型树脂的情况下，将基板安装在下模和上模之间，然后将熔融模制树脂填充在下模和上模之间的空间中。 在固体成形树脂设置在半导体芯片的顶面的情况下，将基板安装在下模上，然后将固体成型树脂加热熔融成具有流动性的液态成型树脂。 上模具安装在下模具上，熔融模塑树脂填充在下模和上模之间的空间中。

公开(公告)号：US08956921B2

公开(公告)日：2015-02-17

申请号：US13836553

申请日：2013-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

IPC: H01L21/16 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L21/565 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/06562

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

公开(公告)号：US20130203220A1

公开(公告)日：2013-08-08

申请号：US13836553

申请日：2013-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

IPC: H01L21/56

CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L21/565 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/06562

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.