APPARATUS FOR PREHEATING A SUBSTRATE
    2.
    发明公开

    公开(公告)号:US20240170308A1

    公开(公告)日:2024-05-23

    申请号:US18215258

    申请日:2023-06-28

    CPC classification number: H01L21/67115 H01L21/67017 H01J37/3171

    Abstract: An apparatus for preheating a substrate includes a preheating chamber, a cooling plate, a heater, an isolation plate, a gas supplier and a gas discharger. The preheating chamber may be configured to receive the substrate. The cooling plate may be arranged on an upper surface of the preheating chamber. The heater may be arranged between the cooling plate and the substrate to heat the substrate. The isolation plate may be arranged between the cooling plate and the substrate to form a first space between the preheating chamber and the isolation plate and a second space between the cooling plate and the isolation plate. The gas supplier may be configured to individually supply a vent gas to the first space and the second space. The gas discharge may be configured to individually supply vacuum to the first space and the second space.

    WAFER HEATING APPARATUS
    3.
    发明公开

    公开(公告)号:US20240068748A1

    公开(公告)日:2024-02-29

    申请号:US18204459

    申请日:2023-06-01

    CPC classification number: F27B17/0025 H05B3/0047

    Abstract: A wafer heating apparatus may include a heating chamber having an internal space and a heating lamp disposed in the internal space of the heating chamber. The heating lamp may be configured to heat a wafer. The heating lamp may include a plurality of lamps. Each of the plurality of lamps may have circular band shapes with open regions. At least one lamp may be disposed in at least one region among regions adjacent to the open regions of the plurality of lamps.

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