公开(公告)号：US12210389B2

公开(公告)日：2025-01-28

申请号：US17475526

申请日：2021-09-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsoo Kim ,  Sookyu Lee ,  Jaewoong Lim

IPC: C23C22/24 ,  C09D5/44 ,  C23C24/08 ,  C23F17/00 ,  C23G5/032 ,  C25D11/30 ,  C25D13/20 ,  G06F1/16 ,  H05K5/02 ,  H05K5/04

Abstract: A method for manufacturing a cover member for electronic devices according to certain embodiments of the present disclosure may comprise: a step for forming a magnesium plate; a step for performing primary CNC processing on the magnesium plate using a predetermined cutting oil; a step for performing a primary pretreatment on the magnesium plate using chromate or micro arc oxidation (MAO); a step for performing a primary surface-treatment on the magnesium plate by bake-coating or electrodeposition coating; a step for performing secondary CNC processing on a first region of the magnesium plate using an alcohol-containing cutting oil; a washing and drying step; a step for performing a secondary pretreatment for preventing oxidation on the first region; and a step for performing a secondary surface-treatment on the first region by bake-coating or electrodeposition coating.