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公开(公告)号：US20210251071A1
公开(公告)日：2021-08-12
申请号：US17171461
申请日：2021-02-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun LEE , Byeongkeol KIM , Yeongjin LEE , Jongmin JEON , Jaeyoub JUNG , Eunseok HONG
Abstract: The disclosure relates to a rigid-flexible printed circuit board and an electronic device including same. The electronic device may include: a housing; a first module disposed in one region of the housing; a second module disposed in an other region of the housing and spaced apart from the first module; and a rigid-flexible printed circuit board electrically connecting the first module and the second module, wherein the rigid-flexible printed circuit board includes: a rigid region; a flexible region coupled to the rigid region, wherein a part of the flexible region overlaps the rigid region; and a protective layer laminated on at least one of an upper end or a lower end of the flexible region to cover at least a part of a coupling portion of the rigid region and the flexible region by a designated numerical value, the coupling portion having a tensile strength equal to or greater than a designated strength based on the flexible region being bent. Various other embodiments are possible.
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2.发明申请公开(公告)号：US20250113442A1
公开(公告)日：2025-04-03
申请号：US18980026
申请日：2024-12-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byeongkeol KIM , Youngsun LEE , Eunseok HONG
Abstract: A composite film includes: a base film layer; a first metal thin film layer on a first surface of the base film layer; and a second metal thin film layer on a second surface of the base film layer, opposite to the first surface, wherein the first metal thin film layer and the second metal thin film layer include a soft etching-treated area and at least one oxide surface-treated area, and wherein the soft etching-treated area has a surface roughness that is different from a surface roughness of the at least one oxide surface-treated area.
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公开(公告)号：US20230354511A1
公开(公告)日：2023-11-02
申请号：US18348622
申请日：2023-07-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun LEE , Kideok KIM , Byeongkeol KIM , Jongbum LEE , Jongmin JEON , Jeongbeom CHO
CPC classification number: H05K1/0281 , H05K1/147 , H05K3/28 , H05K2201/10378
Abstract: An electronic device is provided. The electronic device includes a housing, a main circuit board arranged inside the housing, and at least one flexible circuit board electrically connected to the main circuit board, wherein the flexible circuit board includes a flexible circuit part, and a joining part arranged on one end of the flexible circuit part and connected to the main circuit board. A first joining part includes a first layer oriented a first direction and having at least one first connection hole, a second layer oriented in a second direction opposite to the first direction and has at least one second connection hole, and a reinforcement member which is arranged between the first and the second layer and is connected to the flexible circuit part while being arranged such that at least a portion thereof overlaps with the one end part of the flexible circuit part.
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Patent Agency Ranking
公开(公告)号：US20220322522A1
公开(公告)日：2022-10-06
申请号：US17298810
申请日：2021-05-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun LEE , Eunseok HONG , Byeongkeol KIM , Jongmin JEON
Abstract: Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.
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公开(公告)号：US20230363082A1
公开(公告)日：2023-11-09
申请号：US18348003
申请日：2023-07-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byeongkeol KIM , Eunseok HONG , Youngsun LEE
CPC classification number: H05K1/0219 , H05K1/028 , H05K1/118 , H05K3/28 , H05K3/429 , H04M1/0277 , H04B1/0053 , H05K2201/09636
Abstract: An electronic device is provided. The electronic device includes a housing including a first housing part and a second housing part movable with respect to the first housing part, and a circuit board positioned in the housing and including a first part bent in response to movement of the second housing part and a second part extending from the first part and more rigid than the first part, wherein the circuit board may comprise a flexible non-conductive film extending from the first part to the second part, a laminate structure including at least one conductive pattern positioned on the flexible non-conductive film, a coverlay extending from the first part to the second part, overlapping the laminate structure, and including an electromagnetic shielding material, and at least one conductive via positioned at the second part and electrically connecting the at least one conductive pattern and the coverlay.
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公开(公告)号：US20210168934A1
公开(公告)日：2021-06-03
申请号：US17265888
申请日：2019-08-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun LEE , Eunseok HONG , Byeongkeol KIM , Jongmin JEON
Abstract: Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.
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公开(公告)号：US20250063676A1
公开(公告)日：2025-02-20
申请号：US18937936
申请日：2024-11-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun LEE , Byeongkeol KIM , Sungjin KIM , Jaeyeon RA , Yongjae SONG , Jongmin JEON
Abstract: An electronic device comprises: a first housing; a second housing; a hinge structure comprising a hinge rotatably connecting the first housing with the second housing; and a substrate including a flexible portion, a rigid portion, and a stepped portion arranged at a boundary between the flexible portion and the rigid portion. The substrate comprises: a first conductive layer arranged in the flexible portion and the rigid portion; a first coating layer arranged on a portion of the first conductive layer corresponding to the rigid portion; a second conductive layer arranged on the first coating layer in the rigid portion; and a second coating layer arranged on the second conductive layer. A portion of the boundary of the first coating layer is aligned in the stepped portion.
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公开(公告)号：US20230119170A1
公开(公告)日：2023-04-20
申请号：US18084994
申请日：2022-12-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun LEE , Dohyeon KIM , Byeongkeol KIM , Jinsu KIM , Seokjoon PARK , Jungje BANG , Hoyeon SEO , Jongbum LEE , Jongmin JEON
Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder
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