Electronic device in which tray for loading SIM card is inserted, and control method therefor

    公开(公告)号:US11349516B2

    公开(公告)日:2022-05-31

    申请号:US16961114

    申请日:2018-11-06

    Abstract: Various embodiments of the present invention relate to a method for accurately detecting, by an electronic device, that a tray for loading a SIM card is detached. An electronic device according to various embodiments of the present invention may comprise: a tray for loading a SIM card; a first processor electrically connected to the tray; and a second processor electrically connected to the first processor, wherein the first processor is configured to transfer a pre-event to the second processor when a detachment event for the tray is detected, and the second processor is configured to identify, in each designated period, whether the SIM card is erroneous; and delay identification of whether the SIM card is erroneous, in response to reception of the pre-event. The present invention may further include various other embodiments.

    Electronic device comprising sensing panel

    公开(公告)号:US11249570B2

    公开(公告)日:2022-02-15

    申请号:US16763948

    申请日:2018-11-07

    Abstract: An electronic device according to various embodiments may include an electromagnetic radiation (EMR) sensor panel and a sensor circuit configured to detect a stylus pen, using the EMR sensor panel, wherein the EMR sensor panel comprises a first layer, a second layer, and a third layer which are substantially parallel to the display panel, the first layer comprises a first plurality of conductive lines which extend parallel to one another in a first direction, the second layer comprises a second plurality of conductive lines which extend parallel to one another in a second direction substantially perpendicular to the first direction, and the third layer includes a third plurality of conductive lines, each of the third plurality of conductive lines electrically connected to ends of respective two of the first plurality of the conductive lines or the second plurality of the conductive lines, through conductive vias formed through at least one of the first layer, the second layer, or the third layer.

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