公开(公告)号：US10962581B2

公开(公告)日：2021-03-30

申请号：US16575805

申请日：2019-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Nyeong Yun ,  Jae Moo Choi ,  Jong Pill Park ,  Jae Hong Kim

IPC: G01R31/01 ,  G01R31/28 ,  G01R1/073 ,  G01R31/319

Abstract: A semiconductor integrated circuit test system can include a first semiconductor integrated circuit tester configured to conduct a first test of a first characteristic of one of a plurality of semiconductor integrated circuits, wherein the first test is completed by the first semiconductor integrated circuit tester within a first test time. A second semiconductor integrated circuit tester, can be coupled to the first semiconductor integrated circuit tester, where the second semiconductor integrated circuit tester can be configured to conduct a second test of a second characteristic of each of the plurality of the semiconductor integrated circuits simultaneously, wherein the second test is completed within a second test time that is at least about two orders of magnitude more than the first test time.

公开(公告)号：US12027541B2

公开(公告)日：2024-07-02

申请号：US17502499

申请日：2021-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Hong Kim ,  Dae Hwa Paik ,  Seung Hyun Lim ,  Sin Hwan Lim

IPC: H01L27/146 ,  H04N25/75 ,  H04N25/767 ,  H04N25/778 ,  H04N25/78

CPC classification number: H01L27/14609 ,  H01L27/14603 ,  H04N25/75 ,  H04N25/767 ,  H04N25/778 ,  H04N25/78

Abstract: An image sensor includes a first column line and a second column line configured to extend in a first direction, a plurality of pixel groups configured to connect to the first column line or the second column line and to comprise a plurality of pixels in each of the plurality of pixel groups, a bias circuit configured to comprise a first current circuit and a second current circuit configured to output different bias currents in a first operational mode, and a switching circuit configured to connect the first column line to the first current circuit and connect the second column line to the second current circuit during a first time period, and to connect the first column line to the second current circuit and connect the second column line to the first current circuit during a second time period subsequent to the first time period in the first operational mode.

公开(公告)号：US11604220B2

公开(公告)日：2023-03-14

申请号：US17517057

申请日：2021-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung Il Kim ,  Se-Hyun Seo ,  Byeong Min Yu ,  Jae Hong Kim ,  Sang Jae Rhee ,  Young Chyel Lee

IPC: G01R31/28 ,  G01R1/04

Abstract: A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.

公开(公告)号：US10972693B2

公开(公告)日：2021-04-06

申请号：US16727571

申请日：2019-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hong Kim ,  Seung Hyun Lim ,  Han Kook Cho ,  Dong Hun Lee ,  Seog Heon Ham

IPC: H04N5/374 ,  H04N5/3745 ,  H04N5/365 ,  H04N5/378

Abstract: An image sensor and an image processing system including the same are provided. The image sensor includes a pixel array including a plurality of pixels each connected to one of first through m-th column lines to output a pixel signal, where “m” is an integer of at least 2; analog-to-digital converters each configured to receive the pixel signal corresponding to one of the first through m-th column lines, to compare the pixel signal with a ramp signal, and to convert the pixel signal to a digital pixel signal; and a blocking circuit connected to an input terminal of at least one of the analog-to-digital converters to block an influence of an operation of others among the analog-to-digital converters.

公开(公告)号：US11349516B2

公开(公告)日：2022-05-31

申请号：US16961114

申请日：2018-11-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Soo Park ,  Jae Hong Kim ,  Jang Hoon Lee

IPC: H04B1/38 ,  H04B1/3818 ,  G06F11/07

Abstract: Various embodiments of the present invention relate to a method for accurately detecting, by an electronic device, that a tray for loading a SIM card is detached. An electronic device according to various embodiments of the present invention may comprise: a tray for loading a SIM card; a first processor electrically connected to the tray; and a second processor electrically connected to the first processor, wherein the first processor is configured to transfer a pre-event to the second processor when a detachment event for the tray is detected, and the second processor is configured to identify, in each designated period, whether the SIM card is erroneous; and delay identification of whether the SIM card is erroneous, in response to reception of the pre-event. The present invention may further include various other embodiments.

公开(公告)号：US10444270B2

公开(公告)日：2019-10-15

申请号：US15455818

申请日：2017-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Nyeong Yun ,  Jae Moo Choi ,  Jong Pill Park ,  Jae Hong Kim

IPC: G01R31/01 ,  G01R31/28 ,  G01R1/073 ,  G01R31/319

Abstract: A semiconductor integrated circuit test system can include a first semiconductor integrated circuit tester configured to conduct a first test of a first characteristic of one of a plurality of semiconductor integrated circuits, wherein the first test is completed by the first semiconductor integrated circuit tester within a first test time. A second semiconductor integrated circuit tester, can be coupled to the first semiconductor integrated circuit tester, where the second semiconductor integrated circuit tester can be configured to conduct a second test of a second characteristic of each of the plurality of the semiconductor integrated circuits simultaneously, wherein the second test is completed within a second test time that is at least about two orders of magnitude more than the first test time.

公开(公告)号：US09800843B2

公开(公告)日：2017-10-24

申请号：US14973700

申请日：2015-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Hyun Lim ,  Jae Hong Kim ,  Han Kook Cho ,  Dong Hun Lee ,  Jin Uk Jeon ,  Seog Heon Ham

IPC: H04N5/345 ,  H04N5/232 ,  H04N5/335 ,  H04N9/04 ,  H04N5/365 ,  H04N5/378

CPC classification number: H04N9/045 ,  H04N5/3456 ,  H04N5/3651 ,  H04N5/378

Abstract: An image sensor for reducing channel variation and an image processing system including the same. The image sensor includes first to mth pixels (m≧2), each of which is connected to a corresponding column line from among first to mth column lines and is configured to output a respective pixel signal.’ The image sensor further includes first to mth bias circuits, each of which is connected to a corresponding column line from among the first to mth column lines and is configured to fix a voltage of the corresponding column line to a bias voltage when a column line-specific pixel is not selected to output the respective pixel signal. An analog-to-digital converter in the image sensor is configured to convert the pixel signals into digital signals.

公开(公告)号：US12199115B2

公开(公告)日：2025-01-14

申请号：US18599687

申请日：2024-03-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Hong Kim ,  Dae Hwa Paik ,  Seung Hyun Lim ,  Sin Hwan Lim

IPC: H01L27/146 ,  H04N25/75 ,  H04N25/767 ,  H04N25/778 ,  H04N25/78

Abstract: An image sensor includes a first column line and a second column line configured to extend in a first direction, a plurality of pixel groups configured to connect to the first column line or the second column line and to comprise a plurality of pixels in each of the plurality of pixel groups, a bias circuit configured to comprise a first current circuit and a second current circuit configured to output different bias currents in a first operational mode, and a switching circuit configured to connect the first column line to the first current circuit and connect the second column line to the second current circuit during a first time period, and to connect the first column line to the second current circuit and connect the second column line to the first current circuit during a second time period subsequent to the first time period in the first operational mode.

公开(公告)号：US10084982B2

公开(公告)日：2018-09-25

申请号：US15087043

申请日：2016-03-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hong Kim ,  Seung Hyun Lim ,  Han Kook Cho ,  Dong Hun Lee ,  Seog Heon Ham

IPC: H04N5/374 ,  H04N5/3745 ,  H04N5/365 ,  H04N5/378

CPC classification number: H04N5/37455 ,  H04N5/3658 ,  H04N5/374 ,  H04N5/378

Abstract: An image sensor and an image processing system including the same are provided. The image sensor includes a pixel array including a plurality of pixels each connected to one of first through m-th column lines to output a pixel signal, where “m” is an integer of at least 2; analog-to-digital converters each configured to receive the pixel signal corresponding to one of the first through m-th column lines, to compare the pixel signal with a ramp signal, and to convert the pixel signal to a digital pixel signal; and a blocking circuit connected to an input terminal of at least one of the analog-to-digital converters to block an influence of an operation of others among the analog-to-digital converters.

公开(公告)号：US11152407B2

公开(公告)日：2021-10-19

申请号：US16354593

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Hong Kim ,  Dae Hwa Paik ,  Seung Hyun Lim ,  Sin Hwan Lim

IPC: H01L27/146 ,  H04N5/378

Abstract: An image sensor includes a first column line and a second column line configured to extend in a first direction, a plurality of pixel groups configured to connect to the first column line or the second column line and to comprise a plurality of pixels in each of the plurality of pixel groups, a bias circuit configured to comprise a first current circuit and a second current circuit configured to output different bias currents in a first operational mode, and a switching circuit configured to connect the first column line to the first current circuit and connect the second column line to the second current circuit during a first time period, and to connect the first column line to the second current circuit and connect the second column line to the first current circuit during a second time period subsequent to the first time period in the first operational mode.