公开(公告)号：US10203724B2

公开(公告)日：2019-02-12

申请号：US15160481

申请日：2016-05-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byoung-Uk Yoon ,  Min-Su Chang ,  Soon-Ho Han ,  Jong-Chul Choi ,  Jeong-Hoon Oh

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  B32B38/18 ,  B32B37/10 ,  B32B38/10

Abstract: According to various embodiments of the present disclosure, there is provided a fabrication method for fabricating an exterior member of an electronic device. The fabrication method may include a film disposing step of disposing a film on an exterior member in which one face is formed as a first curved face, and a lamination step of laminating the film on the exterior member. The fabrication method as described above may be variously implemented according to embodiments.

公开(公告)号：US20160339679A1

公开(公告)日：2016-11-24

申请号：US15160481

申请日：2016-05-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byoung-Uk Yoon ,  Min-Su Chang ,  Soon-Ho Han ,  Jong-Chul Choi ,  Jeong-Hoon Oh

IPC: B32B37/00 ,  G06F1/16 ,  B32B37/18

CPC classification number: G06F1/1633 ,  B32B37/10 ,  B32B38/10 ,  B32B38/1833 ,  B32B38/1866 ,  B32B2037/1072 ,  B32B2310/0843 ,  B32B2398/10 ,  B32B2457/00 ,  G06F2200/1633

Abstract: According to various embodiments of the present disclosure, there is provided a fabrication method for fabricating an exterior member of an electronic device. The fabrication method may include a film disposing step of disposing a film on an exterior member in which one face is formed as a first curved face, and a lamination step of laminating the film on the exterior member. The fabrication method as described above may be variously implemented according to embodiments.

Abstract translation: 根据本公开的各种实施例，提供了一种用于制造电子设备的外部构件的制造方法。 该制造方法可以包括将膜设置在作为第一曲面的一个面的外部构件上的膜配置工序，以及将膜层叠在外部构件上的层叠工序。 根据实施例可以各种实现如上所述的制造方法。