公开(公告)号：US20220223538A1

公开(公告)日：2022-07-14

申请号：US17585913

申请日：2022-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehee NAM ,  Yanghwan KIM ,  Dongkil CHOI ,  Jeongho KANG

IPC: H01L23/552 ,  H01L23/498

Abstract: Certain embodiments of the disclosure relate to an electronic device including a substrate having a shielding structure. The electronic device may include a first substrate, a second substrate, and a third substrate. The second substrate may include a first metal pattern connected to ground and including multiple first slits formed by removing a portion of the first metal pattern, each of the first slits having a cross shape, a second metal pattern connected to the ground and including multiple second slits formed by removing a portion of the second metal pattern, each of the second slits having the cross shape, and multiple ground vias extending through at least a portion of the second substrate so as to connect the first metal pattern of the first metal layer to the second metal pattern of the second metal layer. Various other embodiments are also disclosed.

公开(公告)号：US20230010549A1

公开(公告)日：2023-01-12

申请号：US17845419

申请日：2022-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namwoo KIM ,  Sungkwan PARK ,  Jeongho KANG ,  Changi PARK ,  Seunggil JEON ,  Hyunchul HONG

IPC: H01Q3/34 ,  H01Q1/20 ,  H01Q1/52

Abstract: An electronic device is provided. The electronic device includes a housing including a conductive part, a device substrate disposed in an inner space of the housing, an antenna structure, disposed in the inner space to form a directional beam and including a substrate, an array antenna including a plurality of antenna elements disposed on the substrate and a support bracket to support the substrate, an electrical connection member connecting the substrate to the device substrate, a conductive contact connecting the electrical connection member to the conductive part, a first wireless communication circuit disposed in the inner space and configured to transmit or receive a first wireless signal in a first frequency band through the antenna structure, and a second wireless communication circuit disposed on the device substrate and configured to transmit or receive a second wireless signal in a second frequency band through the conductive part.

公开(公告)号：US20210305739A1

公开(公告)日：2021-09-30

申请号：US17250491

申请日：2019-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon GHIM ,  Jeongho KANG ,  Youngmin LEE ,  Yunbum LEE ,  Seongbeom HONG

IPC: H01R12/79 ,  H01P3/08 ,  H04B1/00 ,  H04M1/02

Abstract: The disclosure relates to an apparatus for connecting modules included in an electronic device, and the apparatus may comprise: a power source between a first module of an electronic device and a second module of the electronic device; at least one line unit including lines for transferring a control signal, an intermediate (IF) signal, or a radio frequency (RF) signal; a first connector unit for connecting at least one of the lines to the first module; a second connector unit for connecting at least one of the lines to the second module; and a connection unit for connecting at least one external apparatus and at least one line for transferring the IF signal or the RF signal from among the lines.

公开(公告)号：US20180241369A1

公开(公告)日：2018-08-23

申请号：US15899121

申请日：2018-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon GHIM ,  Jeongho KANG ,  Namwoo KIM ,  Yunbum LEE ,  Haimin LEE

IPC: H03H7/46 ,  H04B1/00 ,  H04B1/28 ,  H04B1/403 ,  H04W72/04 ,  H04W8/00 ,  H04W88/02

Abstract: A front end module supporting a plurality of frequency bands and an electronic device includes a plurality of duplexers, a first switch configured to connect any one of the plurality of duplexers to an antenna, a second switch configured to connect a first port, to which a Tx signal of a first communication or a Tx signal of a second communication is input, to any one of Tx ports of the plurality of duplexers, and to connect a second port, from which a Rx signal of the second communication is output, to one of the Tx ports of the plurality of duplexers. According to certain embodiments, the number of switches occupying a large space can be minimized, and thus a space occupied by the front end module supporting device to device (D2D) communication can be reduced.

公开(公告)号：US20240406298A1

公开(公告)日：2024-12-05

申请号：US18585543

申请日：2024-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changi PARK ,  Jeongho KANG ,  Namwoo KIM ,  Minho KIM ,  Hyunchul HONG ,  Byoungjun KIM ,  Jaeuk AHN ,  Yeonggyu YOON ,  Junyoung CHOI ,  Byounguk YOON

IPC: H04M1/02 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H04N23/68

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure includes: a display defining a first surface of the electronic device, a housing defining a second surface of the electronic device spaced apart from the first surface, and a camera assembly at least partially disposed between the first surface and the second surface. The camera assembly includes: a case including a first camera hole open toward the first surface and a second camera hole open toward the second side, a rotary body rotatably disposed between the first camera hole and the second camera hole and including a first reflective surface configured to reflect light passing through the first camera hole, and a second reflective surface configured to reflect light passing through the second camera hole, an image sensor spaced apart from the rotary body and configured to receive the light reflected from the first and/or second reflective surface, a lens barrel disposed between the image sensor and the rotating body, a lens disposed inside the lens barrel, and an actuator configured to move the image sensor along a direction in which the image sensor and the rotary body are spaced apart from each other.