公开(公告)号：US20190244906A1

公开(公告)日：2019-08-08

申请号：US16170804

申请日：2018-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Ah MIN ,  Ye Chung CHUNG

IPC: H01L23/538 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/5386 ,  H01L23/49811 ,  H01L23/5384 ,  H01L25/0655 ,  H01L27/124

Abstract: Semiconductor packages are provided. A semiconductor package includes a substrate including a first bonding region, a chip region, and a second bonding region. Moreover, the substrate includes first and second surfaces that are opposite to each other. The semiconductor package includes a pad group including a pad on the first surface in the chip region. The semiconductor package includes a semiconductor chip on the pad group. The semiconductor package includes a wire connecting the pad and the second bonding region. The wire includes a portion that extends along the second surface of the substrate. Related display devices are also provided.