公开(公告)号：US20240258489A1

公开(公告)日：2024-08-01

申请号：US18491145

申请日：2023-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woon Bae KIM ,  Ye Chung CHUNG

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/64

Abstract: A display device is provided. The display device includes a substrate including a display region and a non-display region adjacent to the display region in a first horizontal direction, a light-emitting element layer on an upper surface of the substrate in the display region, a thin-film substrate connected to the upper surface of the substrate in the non-display region, a first semiconductor chip on a lower surface of the substrate, at least a portion of the first semiconductor chip overlapping with the thin-film substrate in a vertical direction, and a first through-via in the non-display region, the first through-via extending through the substrate in the vertical direction, the first through-via electrically connecting the thin-film substrate and the first semiconductor chip to each other.

公开(公告)号：US20200303270A1

公开(公告)日：2020-09-24

申请号：US16897468

申请日：2020-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： So Young LIM ,  Ye Chung CHUNG

IPC: H01L21/66 ,  H01L23/498 ,  H01L23/00 ,  H05K1/03 ,  H05K1/02

Abstract: A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.

公开(公告)号：US20190244906A1

公开(公告)日：2019-08-08

申请号：US16170804

申请日：2018-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Ah MIN ,  Ye Chung CHUNG

IPC: H01L23/538 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/5386 ,  H01L23/49811 ,  H01L23/5384 ,  H01L25/0655 ,  H01L27/124

Abstract: Semiconductor packages are provided. A semiconductor package includes a substrate including a first bonding region, a chip region, and a second bonding region. Moreover, the substrate includes first and second surfaces that are opposite to each other. The semiconductor package includes a pad group including a pad on the first surface in the chip region. The semiconductor package includes a semiconductor chip on the pad group. The semiconductor package includes a wire connecting the pad and the second bonding region. The wire includes a portion that extends along the second surface of the substrate. Related display devices are also provided.

公开(公告)号：US20190122943A1

公开(公告)日：2019-04-25

申请号：US16115751

申请日：2018-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： So Young LIM ,  Ye Chung CHUNG

IPC: H01L21/66 ,  H01L23/498 ,  H01L23/00 ,  H05K1/03 ,  H05K1/02

Abstract: A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.