公开(公告)号：US20190265291A1

公开(公告)日：2019-08-29

申请号：US16151826

申请日：2018-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chan-Sik Kwon ,  Jin Duck Park ,  Jin Wook Jang ,  Ji-Yeon Han

IPC: G01R31/11 ,  H01L23/58 ,  H01L23/528 ,  H01L23/00

Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.

公开(公告)号：US10788528B2

公开(公告)日：2020-09-29

申请号：US16151826

申请日：2018-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan-Sik Kwon ,  Jin Duck Park ,  Jin Wook Jang ,  Ji-Yeon Han

IPC: G01R31/11 ,  H01L23/58 ,  H01L23/00 ,  H01L23/528

Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.

公开(公告)号：US11740276B2

公开(公告)日：2023-08-29

申请号：US17019936

申请日：2020-09-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan-Sik Kwon ,  Jin Duck Park ,  Jin Wook Jang ,  Ji-Yeon Han

IPC: G01R31/11 ,  H01L23/58 ,  H01L23/00 ,  H01L23/528

CPC classification number: G01R31/11 ,  H01L23/528 ,  H01L23/562 ,  H01L23/585 ,  H01L24/06 ,  H01L2224/06131

Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.