公开(公告)号：US20240096728A1

公开(公告)日：2024-03-21

申请号：US18340101

申请日：2023-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Kyeong Seol ,  Hyuek Jae Lee

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L23/367 ,  H01L23/3107 ,  H01L24/08 ,  H01L25/0657 ,  H10B80/00 ,  H01L2224/08145

Abstract: A semiconductor package is provided. The semiconductor package comprises a first semiconductor die including a memory, a second semiconductor die including a memory and on the first semiconductor die, a dummy die on the semiconductor device and not including a memory, a heat sink on the dummy die and including a metal material and a mold film on side surfaces of each of the first semiconductor die, the second semiconductor die, the dummy die, and the heat sink. A width of the heat sink may decrease away from a top surface of the dummy die, and side surfaces of the heat sink may be curved.