公开(公告)号：US09738057B2

公开(公告)日：2017-08-22

申请号：US14063529

申请日：2013-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeon-jin Shin ,  Sang-Woo Kim ,  Jin yeong Lee

IPC: B32B15/04 ,  C23C16/34 ,  H01L21/02 ,  C23C28/00

CPC classification number: B32B15/04 ,  B32B2457/00 ,  C23C16/342 ,  C23C28/34 ,  H01L21/02458 ,  Y10T428/31678

Abstract: A substrate assembly includes a first hexagonal boron nitride sheet directly bonded to a surface of a substrate, and a metal layer on the first hexagonal boron nitride sheet.

公开(公告)号：US10099449B2

公开(公告)日：2018-10-16

申请号：US15628891

申请日：2017-06-21

Applicant: Samsung Electronics Co., Ltd. ,  Sungkyunkwan University Foundation for Corporate Collaboration

Inventor： Hyeon-jin Shin ,  Sang-Woo Kim ,  Jin yeong Lee

IPC: C23C16/34 ,  B32B15/04 ,  C23C28/00 ,  H01L21/02

Abstract: A method of forming a substrate assembly includes preparing a substrate in a chamber, combining a solid-state nitrogen source and a boron source on the substrate, forming a metal layer on a surface of the substrate including the combined solid-state nitrogen and boron sources, and forming a first hexagonal boron nitride sheet directly bonded to the surface of the substrate by performing a heat treatment on the substrate including the metal layer and the combined solid-state nitrogen and boron sources.