METHODS OF FORMING INSULATION LAYER STRUCTURES AND METHODS OF MANUFACTURING METAL INTERCONNECTIONS
    3.
    发明申请
    METHODS OF FORMING INSULATION LAYER STRUCTURES AND METHODS OF MANUFACTURING METAL INTERCONNECTIONS 审中-公开
    形成绝缘层结构的方法和制造金属互连的方法

    公开(公告)号:US20150241780A1

    公开(公告)日:2015-08-27

    申请号:US14607252

    申请日:2015-01-28

    CPC classification number: G03F7/30 G03F7/0017 G03F7/0035 G03F7/322 G03F7/38

    Abstract: In a method of an insulation layer structure, a first photosensitive layer is formed on a substrate. The first photosensitive layer is partially exposed to form a first pattern and a second pattern. The second pattern includes silicon oxide. A second photosensitive layer is formed on the second pattern. The second photosensitive layer is partially exposed to form a third pattern and a fourth pattern. The fourth pattern includes silicon oxide. The first pattern is removed by performing a first developing process. The third pattern is removed by performing a second developing process.

    Abstract translation: 在绝缘层结构的方法中,在基板上形成第一感光层。 第一感光层部分地暴露以形成第一图案和第二图案。 第二图案包括氧化硅。 第二感光层形成在第二图案上。 第二感光层被部分曝光以形成第三图案和第四图案。 第四图案包括氧化硅。 通过执行第一显影过程来去除第一图案。 通过执行第二显影过程来去除第三图案。

    SEMICONDUCTOR DEVICE CONTROLLING SOURCE DRIVER AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR DEVICE THE SAME
    5.
    发明申请
    SEMICONDUCTOR DEVICE CONTROLLING SOURCE DRIVER AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR DEVICE THE SAME 审中-公开
    控制源驱动器的半导体器件和包括其半导体器件的显示器件

    公开(公告)号:US20140240365A1

    公开(公告)日:2014-08-28

    申请号:US13836355

    申请日:2013-03-15

    CPC classification number: G09G5/005 G09G5/008 G09G2330/021 G09G2370/045

    Abstract: A semiconductor device includes: a transmitter transforming n data into first serial data and transmitting the first serial data through a first transmission line and transforming m data into second serial data and transmitting the second serial data through a second transmission line, where n and m are natural numbers at least one of which is greater than 1; a first driver integrated circuit (IC) group including n driver ICs; and a second driver IC group including m driver ICs, wherein each of the n driver ICs receives the first serial data through the first transmission line and is driven by part of the first serial data, each of the m driver ICs receives the second serial data through the second transmission line and is driven by part of the second serial data, and each of the n data and the m data includes identification information about a driver IC.

    Abstract translation: 半导体装置包括:发射机将n个数据变换为第一串行数据并通过第一传输线传输第一串行数据,并将m个数据转换成第二串行数据,并通过第二传输线发送第二串行数据,其中n和m是 其中至少一个大于1的自然数; 包括n个驱动器IC的第一个驱动器集成电路(IC)组; 以及包括m个驱动器IC的第二驱动器IC组,其中n个驱动器IC中的每一个通过第一传输线接收第一串行数据,并且由第一串行数据的一部分驱动,每个m个驱动器IC接收第二串行数据 通过第二传输线并由第二串行数据的一部分驱动,并且n个数据和m个数据中的每一个包括关于驱动器IC的识别信息。

Patent Agency Ranking