公开(公告)号：US20180182808A1

公开(公告)日：2018-06-28

申请号：US15835626

申请日：2017-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sun-hyun Kim ,  Han-seok Kim ,  Chung-ho Song ,  Jin-ju Jeon

IPC: H01L27/146 ,  H01L23/544

Abstract: The present disclosure provides an image sensor and a method of manufacturing the same. An image sensor includes a first substrate, a barrier structure, a first structure, a second substrate, and a second structure. The first substrate includes a device region in which unit pixels are disposed and a first residual scribe lane region surrounding the device region. The first substrate has a first surface and a second surface. The barrier structure penetrates the first substrate in the first residual scribe lane region. The first surface of the first substrate is on the first structure. The second substrate includes a second residual scribe lane region facing the first residual scribe lane region. The second substrate has a front surface and a rear surface. The second structure is on the front surface of the second substrate and faces the first surface of the first substrate. The second structure is bonded to the first structure.

公开(公告)号：US20200066784A1

公开(公告)日：2020-02-27

申请号：US16671876

申请日：2019-11-01

Applicant: Samsung Electronics Co.,Ltd.

Inventor： Sun-hyun KIM ,  Han-seok Kim ,  Chung-ho Song ,  Jin-ju Jeon

IPC: H01L27/146 ,  H01L23/544

Abstract: The present disclosure provides an image sensor and a method of manufacturing the same. An image sensor includes a first substrate, a barrier structure, a first structure, a second substrate, and a second structure. The first substrate includes a device region in which unit pixels are disposed and a first residual scribe lane region surrounding the device region. The first substrate has a first surface and a second surface. The barrier structure penetrates the first substrate in the first residual scribe lane region. The first surface of the first substrate is on the first structure. The second substrate includes a second residual scribe lane region facing the first residual scribe lane region. The second substrate has a front surface and a rear surface. The second structure is on the front surface of the second substrate and faces the first surface of the first substrate. The second structure is bonded to the first structure.

公开(公告)号：US10483317B2

公开(公告)日：2019-11-19

申请号：US15835626

申请日：2017-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sun-hyun Kim ,  Han-seok Kim ,  Chung-ho Song ,  Jin-ju Jeon

IPC: H01L27/146 ,  H01L23/544

Abstract: The present disclosure provides an image sensor and a method of manufacturing the same. An image sensor includes a first substrate, a barrier structure, a first structure, a second substrate, and a second structure. The first substrate includes a device region in which unit pixels are disposed and a first residual scribe lane region surrounding the device region. The first substrate has a first surface and a second surface. The barrier structure penetrates the first substrate in the first residual scribe lane region. The first surface of the first substrate is on the first structure. The second substrate includes a second residual scribe lane region facing the first residual scribe lane region. The second substrate has a front surface and a rear surface. The second structure is on the front surface of the second substrate and faces the first surface of the first substrate. The second structure is bonded to the first structure.

公开(公告)号：US10797099B2

公开(公告)日：2020-10-06

申请号：US16671876

申请日：2019-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sun-hyun Kim ,  Han-seok Kim ,  Chung-ho Song ,  Jin-ju Jeon

IPC: H01L27/146 ,  H01L23/544

Abstract: The present disclosure provides an image sensor and a method of manufacturing the same. An image sensor includes a first substrate, a barrier structure, a first structure, a second substrate, and a second structure. The first substrate includes a device region in which unit pixels are disposed and a first residual scribe lane region surrounding the device region. The first substrate has a first surface and a second surface. The barrier structure penetrates the first substrate in the first residual scribe lane region. The first surface of the first substrate is on the first structure. The second substrate includes a second residual scribe lane region facing the first residual scribe lane region. The second substrate has a front surface and a rear surface. The second structure is on the front surface of the second substrate and faces the first surface of the first substrate. The second structure is bonded to the first structure.