公开(公告)号：US20240234362A9

公开(公告)日：2024-07-11

申请号：US18477910

申请日：2023-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheolan KWON ,  Jingyu MOON

IPC: H01L23/00 ,  B23K3/02

CPC classification number: H01L24/75 ,  B23K3/025 ,  B23K2101/40 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75621

Abstract: Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

公开(公告)号：US20240136321A1

公开(公告)日：2024-04-25

申请号：US18477910

申请日：2023-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheolan KWON ,  Jingyu MOON

IPC: H01L23/00 ,  B23K3/02

CPC classification number: H01L24/75 ,  B23K3/025 ,  B23K2101/40 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75621

Abstract: Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.