公开(公告)号：US12064907B2

公开(公告)日：2024-08-20

申请号：US17283888

申请日：2019-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsu Kim ,  Sangsik Na ,  Rathore Pranveer Singh ,  Youngjin Yi ,  Jongbae Jeon ,  Donghyeon Hwang ,  Hangyu Hwang ,  Jinhyeong Park ,  Youngik Son

IPC: H05K5/00 ,  B29C45/14 ,  H05K5/04 ,  B29L31/34

CPC classification number: B29C45/14336 ,  H05K5/0017 ,  H05K5/04 ,  B29C2793/009 ,  B29L2031/34

Abstract: A method for manufacturing an electronic device, according to one embodiment of the present invention, may comprise the operations of: inserting and injecting a polymeric material into a structure, which is a plate-shaped metal structure comprising a first surface and a second surface, the structure comprising: at least one opening penetrating the first surface and the second surface; and at least one recess having a first depth from the first surface and extending to have a repeating pattern selected from among a W-shape, a sawtooth shape, and a straight line shape, when viewed from above the first surface; and confirming that the recess is filled with the polymeric material. Various other embodiments are possible.