公开(公告)号：US20240030128A1

公开(公告)日：2024-01-25

申请号：US18204556

申请日：2023-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaepil Lee ,  Junbae Kim ,  Jinkwan Park

IPC: H01L23/522 ,  H10B12/00

CPC classification number: H01L23/5227 ,  H10B12/00

Abstract: A semiconductor device may include a substrate, an element layer including circuit elements arranged on the substrate, a wiring layer on the element layer, and a redistribution layer on the wiring layer. The redistribution layer may include a redistribution insulating layer and a redistribution conductive layer on the redistribution insulating layer. The redistribution conductive layer may include a connection pad and first and second inductor structures respectively including first and second inductor redistribution lines having a planar coil shape, and a connection pad. The first and second inductor redistribution lines respectively included in the first and second inductor structures may have different thicknesses.

公开(公告)号：US20230027964A1

公开(公告)日：2023-01-26

申请号：US17856394

申请日：2022-07-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinkwan Park ,  Janghoo Kim ,  Yoonsuk Park ,  Yoochang Sung ,  Changsik Yoo ,  Jeongdon Ihm

IPC: H01L27/02 ,  H01L49/02 ,  H01L23/66

Abstract: An integrated circuit includes a T-coil formed in a first metal layer, wherein the T-coil may include: a first inductor connected to a first terminal and a second terminal; and a second inductor connected to the second terminal and a third terminal, wherein the first inductor and the second inductor may include a first pattern and a second pattern, respectively, the first and second patterns extending parallel to each other in a first direction from the second terminal in the first metal layer, and wherein the first pattern and the second pattern may form a bridge capacitor of the T-coil.