公开(公告)号：US20220104356A1

公开(公告)日：2022-03-31

申请号：US17487673

申请日：2021-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongkyu MIN ,  Taewoo KIM ,  Jinyong PARK ,  Hyelim YUN ,  Hyeongju LEE ,  Sanghoon PARK ,  Jiseon HAN

IPC: H05K1/14 ,  H05K1/11 ,  H04M1/02 ,  H01L23/528

Abstract: The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.

公开(公告)号：US20240292571A1

公开(公告)日：2024-08-29

申请号：US18658464

申请日：2024-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongkyu MIN ,  Taewoo KIM ,  Jinyong PARK ,  Hyelim YUN ,  Hyeongju LEE ,  Jiseon HAN

IPC: H05K7/20 ,  H05K1/18

CPC classification number: H05K7/20454 ,  H05K1/18 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/10159

Abstract: An electronic device is provided. The electronic device includes a base plate, a first component disposed on the base plate, a second component which is disposed on the base plate and provided at a position spaced apart from the first component, an interposer which is connected to the base plate and surrounds the first component and the second component, a cover plate including a cover plate body which is connected to the interposer and covers the first component and the second component, and a cover hole which is formed to penetrate the cover plate body, and a heat dissipation plate including a heat dissipation plate body which is disposed on the cover plate body and faces the first component and the second component, a heat dissipation hole which is formed to penetrate the heat dissipation plate body and communicates with the cover hole, and a flow guide which is formed on the heat dissipation plate body and guides the flow of a thermal interface material.