公开(公告)号：US20240276632A1

公开(公告)日：2024-08-15

申请号：US18625063

申请日：2024-04-02

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Parker Brown ,  Dongao Yang ,  Michael Lawrence Miller ,  Paul Henry Lego

IPC: H05K1/02 ,  H01M50/519 ,  H05K1/11 ,  H05K3/00 ,  H05K3/04 ,  H05K3/06 ,  H05K3/20 ,  H05K3/28 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K1/0201 ,  H01M50/519 ,  H05K1/118 ,  H05K3/007 ,  H05K3/0073 ,  H05K3/06 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4623 ,  H05K3/046 ,  H05K3/064 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10037 ,  H05K2203/066 ,  Y02E60/10 ,  Y10T29/49156

Abstract: A method of forming a flexible interconnect circuit is described. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

公开(公告)号：US20240268032A1

公开(公告)日：2024-08-08

申请号：US18041042

申请日：2022-08-30

Applicant: HONOR DEVICE CO., LTD.

Inventor： Zhijie XU

IPC: H05K1/18 ,  H05K3/32

CPC classification number: H05K1/183 ,  H05K3/328 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10037

Abstract: Embodiments of this application are applied to the field of terminal technologies, and provide a PCB assembly and an electronic device, where the PCB assembly includes a PCB, a first conductor, a first battery, and a second battery. The PCB includes a groove area. The first battery and the second battery are disposed on different sides of the groove area. The first conductor is disposed in the groove area, and the first conductor is configured to connect the first battery and the second battery. That is, in the embodiments of this application, the first battery and the second battery are connected by using the first conductor in the groove area, which prevents a power cable connecting the first battery and the second battery from occupying an area on the PCB, thereby increasing an area in which other components can be installed on the PCB.

公开(公告)号：US20240250372A1

公开(公告)日：2024-07-25

申请号：US18610738

申请日：2024-03-20

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Hiromitsu SENNAMI

IPC: H01M50/284 ,  H01M10/42 ,  H01M50/202 ,  H01M50/247 ,  H04R1/10 ,  H05K1/02

CPC classification number: H01M50/284 ,  H01M10/425 ,  H01M50/202 ,  H01M50/247 ,  H04R1/1025 ,  H04R1/1041 ,  H05K1/0271 ,  H05K1/028 ,  H01M2220/30 ,  H04R2420/07 ,  H05K2201/10037

Abstract: Provided is a battery pack including: a battery including an electrode portion and having a cylindrical shape; and a circuit board disposed on a circumferential side surface of the battery, in which the circuit board includes a circuit component mounting portion and a wiring part, the circuit component mounting portion includes a reinforcing portion, and the wiring part includes a flexible printed substrate.

公开(公告)号：US12027676B2

公开(公告)日：2024-07-02

申请号：US17547310

申请日：2021-12-10

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Fiona E. Meyer-Teruel ,  Aseim M. Elfrgani ,  Christopher A. O'Brien ,  Sony Mathews ,  Hatem Elgothamy

IPC: H05K1/14 ,  B60K1/04 ,  B60L53/20 ,  H01M10/42 ,  H01M10/48 ,  H01M50/209 ,  H01M50/249 ,  H01M50/519 ,  H01M50/569 ,  H01Q1/52 ,  H02K7/00 ,  H02K11/00 ,  H02K11/33 ,  H04B7/24 ,  H05K9/00

CPC classification number: H01M10/4257 ,  B60K1/04 ,  B60L53/20 ,  H01M10/482 ,  H01M50/209 ,  H01M50/249 ,  H01M50/519 ,  H01M50/569 ,  H01Q1/526 ,  H02K7/006 ,  H02K11/0094 ,  H02K11/33 ,  H04B7/24 ,  H05K1/142 ,  H05K9/006 ,  H05K9/0084 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2220/20 ,  H05K2201/10037 ,  H05K2201/10098

Abstract: An enclosed electrical device such as a battery pack for an electric powertrain system includes an enclosure having a tray and cover. The tray and cover together define an enclosure cavity. A radio frequency (RF) receiving node is located within the cavity. Printed circuit board assemblies (PCBAs) include an RF transmitting node. The PCBAs(s) are spaced apart from one another within the cavity. An RF shield guide layer is positioned between the PCBAs and the cover, such that the RF shield guide layer covers the PCBAs without covering the RF transmitting node. A battery pack and an electric powertrain system include the RF shield guide layer.

公开(公告)号：US20240215171A1

公开(公告)日：2024-06-27

申请号：US18389635

申请日：2023-12-19

Applicant: ARMOUR SURVEILLANCE SECURITY EQUIPMENT AND TECHNOLOGY LTD

Inventor： Patrick James FAWCETT ,  Richard DINAN

IPC: H05K1/18 ,  A44C5/00 ,  H05K1/02

CPC classification number: H05K1/189 ,  A44C5/0007 ,  H05K1/028 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10431 ,  H05K2201/10462

Abstract: A strap for a wearable device comprises a printed circuit board (PCB) located within said strap. The PCB comprises a first electronic component, coupled to a first flexible portion. The first electronic component is mounted to a cage, the cage comprising a cage pivot mount. The flexible portion is under tension and urges said first electronic component towards said cage pivot mount such that a pivotable connection is formed between said cage and said first electronic component. Also disclosed is a method of manufacture of the strap.

公开(公告)号：US11961686B2

公开(公告)日：2024-04-16

申请号：US17602799

申请日：2020-04-17

Applicant: KANDA KOGYO CO., LTD.

Inventor： Haruki Tamamizu ,  Takashi Nakano ,  Tadayoshi Kikuchi ,  Misaki Doi

IPC: H01H13/12 ,  H05K1/18

CPC classification number: H01H13/12 ,  H01H2209/002 ,  H01H2227/032 ,  H05K1/18 ,  H05K2201/10037 ,  H05K2201/10053

Abstract: An irreversible power switch which is operational from the outside after lamination of laminated communication device and the like, includes a substrate, electrodes disposed on the substrate, a brittle member disposed so as to face the electrodes and apart from the electrodes and a conductive adhesive portion disposed on the brittle member at a side to face the electrodes thereof. The electrodes and the conductive adhesive portion are irreversibly and electrically bonded by brittle fracture of the brittle member under the external pressing force in the thickness direction of the laminated communication device.

公开(公告)号：US11943862B2

公开(公告)日：2024-03-26

申请号：US17825508

申请日：2022-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongchoon Park ,  Taewon Sun ,  Sangyong Kim ,  Bosung Choi

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/0242 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/0715 ,  H05K2201/10037

Abstract: An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.

公开(公告)号：US20240097292A1

公开(公告)日：2024-03-21

申请号：US17932794

申请日：2022-09-16

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer ,  Matthew Doyle ,  Kyle Schoneck ,  Layne A. Berge ,  Matthew A. Walther ,  Thomas W. Liang ,  John R. Dangler ,  Jason J. Bjorgaard

IPC: H01M50/583 ,  H05K1/11

CPC classification number: H01M50/583 ,  H05K1/111 ,  H05K2201/10037 ,  H05K2201/10181

Abstract: A voltage source watchdog comprising a passive device is placed in series between a voltage source and a load. The passive device includes an electromigration (EM) joint of known materials that will create an electromigration void after a specified amount of current passes through the EM joint. After a known amount of current as passed through, a void is created and a voltage will no longer be sensed, thus providing a sure safety mode situation. When the voltage source is a battery, the battery life may be extended by selectively enabling voltage measurement operations for the proposed watchdog.

公开(公告)号：US11937393B2

公开(公告)日：2024-03-19

申请号：US17563354

申请日：2021-12-28

Applicant: ARINC Incorporated

Inventor： Curtis Wicks ,  Rameshkumar Balasubramanian ,  Ryan M. Kollman ,  Stephen Welch

IPC: H05K1/14 ,  B64C1/36 ,  B64D41/00 ,  H01Q1/22 ,  H01Q1/42 ,  H04B1/40 ,  H05K1/18 ,  H05K7/10 ,  H01R12/73 ,  H05K7/12

CPC classification number: H05K7/10 ,  B64C1/36 ,  B64D41/00 ,  H01Q1/2258 ,  H01Q1/42 ,  H04B1/40 ,  H05K1/144 ,  H05K1/18 ,  H01R12/73 ,  H05K7/12 ,  H05K2201/09063 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/2036

Abstract: A circuit card assembly is described. The circuit card assembly adapts a host circuit card assembly of a host device with an expansion card. By such adaption, the host device may communicate with an access point of an avionics network. The circuit card assembly includes an interface for receiving power from the host circuit card assembly. The circuit card assembly then continuously and selectively provides power to a second interface based on the availability of aircraft power. The second interface receives the expansion card. The circuit card assembly also includes one or more coaxial RF connectors for receiving modulated signals from the expansion card. The circuit card assembly also includes an antenna which transmits radio waves based on the modulated signals. A system for communication to an access point of an avionics network includes the circuit card assembly.

公开(公告)号：US20240072447A1

公开(公告)日：2024-02-29

申请号：US18387665

申请日：2023-11-07

Applicant: LG Energy Solution, Ltd.

Inventor： Changjoo Lee

IPC: H01Q9/04 ,  H01M10/42 ,  H01Q7/00 ,  H05K1/02

CPC classification number: H01Q9/0464 ,  H01M10/425 ,  H01Q7/00 ,  H05K1/0243 ,  H01M2010/4278 ,  H05K2201/10037 ,  H05K2201/10098

Abstract: The present invention relates to a PCB adopting an edge antenna which designs an antenna pattern in an edge region of the PCB to generate a beam pattern generated from the antenna pattern not in a vertical direction to an antenna plane but in a lateral direction of the PCB, thereby enabling face-to-face communication between large-area battery packs laterally adjacent to each other, and a battery including the PCB adopting the edge antenna.