公开(公告)号：US20250118662A1

公开(公告)日：2025-04-10

申请号：US18735507

申请日：2024-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dohyun Kwon ,  Sunoo Kim ,  Jonghwa Park ,  Yongseung Bang ,  Jaeheon Lee

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/00 ,  H01L23/48 ,  H01L23/522

Abstract: A semiconductor device includes a semiconductor substrate, a first insulating layer disposed on a first surface of the semiconductor substrate, a through via passing through both the semiconductor substrate and the first insulating layer, a protective barrier wall pattern disposed within the first insulating layer and on a sidewall of the through via, a first wiring structure disposed within the first insulating layer and including a first via portion and a first wiring portion, and a second insulating layer disposed on an upper surface of the first insulating layer and at least partially covering an upper surface of the first wiring structure and an upper surface of the protective barrier wall pattern.

公开(公告)号：US11936542B2

公开(公告)日：2024-03-19

申请号：US17828579

申请日：2022-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangkyu Park ,  Jonghwa Park ,  Youngsuk Sun ,  Yunju Lee ,  Panhyung Lee ,  Hakyung Jung

IPC: H04L43/08 ,  H04L41/14

CPC classification number: H04L43/08 ,  H04L41/145

Abstract: A method of solving a problem of a network and an electronic device for performing the method are provided. The electronic device includes at least one processor. The processor may determine a representative cause representing a cause of each of anomaly samples of a quality indicator indicating a quality of the network. The processor may perform a time-series analysis on an indicator associated with the representative cause. The processor may propose a solution corresponding to the representative cause and a result of the time-series analysis.