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公开(公告)号：US20240107141A1
公开(公告)日：2024-03-28
申请号：US18531172
申请日：2023-12-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kiyun JO , Jongjun KIM , Heeyun CHUNG , Kihuk LEE
Abstract: A camera module according to an embodiment may comprise: a printed circuit board including a first opening; a housing assembly comprising a housing arranged on a first surface of the printed circuit board; a first rear member comprising a plate arranged on a second surface of the printed circuit board, and arranged to overlap with the first opening and a part of the printed circuit board; a second rear member comprising a support arranged on the second surface of the printed circuit board and including a second opening in which the first rear member is arranged, and has a thickness thicker than a thickness of the first rear member; an image sensor arranged on one surface of the first rear member and exposed toward the housing assembly through the first opening; and at least one lens aligned to have the same optical axis of the image sensor, and arranged in the inner space of the housing assembly.
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公开(公告)号：US20230164413A1
公开(公告)日：2023-05-25
申请号：US17959758
申请日：2022-10-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongjun KIM , Kiyun JO
CPC classification number: H04N5/2254 , H04N5/2253 , H04N5/2252 , H04M1/0264
Abstract: According to various embodiments of the disclosure, a camera module and/or an electronic device including same may include: a sensor substrate, an image sensor disposed on one surface of the sensor substrate, a sensor enclosure disposed on the sensor substrate surrounding at least a part of the image sensor, and an optical element comprising a filter disposed in the sensor enclosure facing the image sensor, wherein the image sensor may be configured to detect light incident through the optical element, and the sensor enclosure may be attached to an edge of one surface of the image sensor, at least partially facing the optical element.
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